IDCC Connector Assembly With Compliant PCB Pin Retention

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Solution Overview

Problem

Existing IDC connector systems require additional components for securing header pins, such as plastic covers or pronged terminal systems, which complicates the connection process and increases complexity in automotive and similar applications.

Innovation Solution

An Insulation Displacement Contact Compliant (IDCC) connector system that includes IDCC header pins with pin barbs for anchoring into a housing and a compliant retention feature for secure attachment to a printed circuit board, eliminating the need for additional securing components by using a housing with strain relief and retention posts for secure wire insertion and electrical contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional components such as plastic covers or pronged terminal systems are used to secure IDCC header pins, then the header pins can be retained in the housing, but the device complexity increases

Engineering Contradiction:
Improveretention of header pinsVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The housing structure is merged with the retention function by integrating pin retention features directly into the housing body. The housing includes recesses and engagement features that directly retain the IDCC header pins without requiring separate retention components, thus simplifying the overall device structure while maintaining reliable pin retention.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If additional securing components are used for IDCC header pins, then the connection is more secure, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveconnection securityVSAvoidassembly process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The housing is designed as an integrated assembly where the retention features are built-in rather than added separately. This merging of functions allows for simpler manufacturing and assembly processes, as the housing itself provides the retention mechanism without requiring additional securing components to be installed separately.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If a compliant pin structure is used for PCB attachment, then soldering is eliminated, but the retention mechanism becomes more complex

Engineering Contradiction:
ImprovePCB attachment methodVSAvoidretention feature structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The IDCC header pin structure includes built-in compliant retention features that automatically engage with the PCB holes and provide self-retention. The pin design incorporates flexible or compliant sections that allow the pin to secure itself to the PCB without requiring external retention mechanisms or soldering, thus simplifying the overall attachment system.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS20240380132A1IDCC connection system and process
Publication Date: 2024.11.14 JST CORP
  • US20240380132A1 patent drawing
  • US20240380132A1 patent drawing
  • US20240380132A1 patent drawing

AI summary

An Insulation Displacement Contact Compliant connector system (IDCC) which includes a housing, header pins, and a Printed Circuit Board (PCB). Each header pin has at least a single barb to be retained into the housing. Each pin has a blade for contacting a wire. A compliant feature on the pin retains itself into holes in the PCB. The housing has a negative space similarly shaped to the pin. The housing includes a strain relief which provides a lead-in for a wire. When the system is fully assembled, the pins reside in the housing, and exit through the housing and into and through respective holes in the PCB. A wire can be inserted into the housing once the pins reside in the housing. There are several options for the assembly process including a) a pin-to-housing insertion process; b) a housing assembly-to-PCB process or a connector-to-PCB process; and c) a wired housing assembly-to-PCB assembly process or a wire harness-to-PCB assembly process.