Identifiable PCB via Base Plate Identifier and Transparent Lamination
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Solution Overview
Problem
Conventional print circuit board manufacturing methods lack effective monitoring of the manufacturing process, making it difficult to track defects and are costly due to frequent use of laser processing, and RFID technology is not suitable due to high temperature and pressure tolerance issues.
Innovation Solution
A method involving a primary identifier on the base plate, a light-emitting insulating layer with a penetrating area, and lamination at high temperature and pressure to create an identifiable print circuit board that allows for monitoring and tracking throughout the manufacturing process, with secondary identifiers for detailed history recording.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If laser processing is frequently carried out to form identifiers on each print circuit board in each manufacturing step, then monitoring precision is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent applies preliminary action by placing the identifier on the base plate before the lamination process begins. This allows the identifier to be positioned and registered early in the manufacturing sequence, enabling traceability without requiring repeated laser processing at each subsequent step. The identifier is prepared in advance and remains visible through the transparent circuit layers during assembly.
Solution Approach 2:
The patent uses a transparent circuit layer that acts as an optical copy medium. The identifier on the base plate can be viewed through the transparent circuit layer, eliminating the need to physically mark each layer separately. This optical copying approach allows single-point identification to serve multiple monitoring purposes throughout the manufacturing process.
2Loss of information
If laser processing is used to form identifiers on each print circuit board, then identification capability is improved, but manufacturing time increases
Solution Approach 1:
The identifier is placed on the base plate before lamination begins, establishing identification capability at the start of the process. This preliminary placement eliminates the need for time-consuming laser processing at each subsequent manufacturing step, thereby reducing total manufacturing time while maintaining full traceability.
Solution Approach 2:
The single identifier on the base plate serves multiple functions throughout the entire manufacturing process. It provides identification capability for the base plate itself, and through the transparent circuit layer, it also identifies the final assembled print circuit board. This multi-functionality eliminates the need for separate identification operations at each stage.
3Loss of information
If RFID chips are used for identification, then monitoring capability is improved, but reliability decreases due to poor tolerance to high temperature and pressure
Solution Approach 1:
The patent uses a simple, non-electronic identifier that can withstand the harsh lamination conditions. Rather than using fragile RFID chips that would fail under high temperature and pressure, the solution employs a robust visual identifier that requires no electronic components and can survive the entire manufacturing process without degradation.
Solution Approach 2:
The transparent circuit layer serves as an intermediary that allows the identifier on the base plate to be viewed through the assembled structure. This intermediary approach enables monitoring capability without requiring heat-sensitive or pressure-sensitive electronic components to be embedded in the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise monitoring and quality control of print circuit boards, reducing costs by allowing timely identification of manufacturing issues and improving process efficiency through clear recognition of identifiers during and after lamination.
Implementation Method 1
lamination, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi
Implementation Method 2
laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi
Implementation Method 3
a light-emitting insulating layer with a penetrating area, and lamination at high temperature and pressure to create an identifiable print circuit board that allows for monitoring and tracking
Data Source
AI summary
A manufacturing method of identifiable print circuit board includes a step of “disposing an identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board.