Identity Recognition Device Thermal Management
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Solution Overview
Problem
Facial recognition devices used in high-traffic areas face challenges in maintaining a safe surface temperature to prevent overheating, which is crucial for safe human contact, as existing devices often exceed the recommended 60°C, and they lack effective heat dissipation methods without fans, leading to potential overheating and dust accumulation.
Innovation Solution
The identity recognition device incorporates a thermal conductive casing with a heat dissipation assembly featuring heat pipes, a heat absorbing block, and a heat dissipation coating with carbon nano-powder and waterproof adhesive, enhancing thermal conductivity and preventing dust accumulation, while maintaining a safe surface temperature without the need for fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation methods (fans) are used, then heat dissipation efficiency is improved, but device complexity and dust accumulation increase
Solution Approach 1:
The patent removes the fan component from the heat dissipation system, extracting the harmful element that causes dust accumulation and device complexity while maintaining heat dissipation function through alternative passive methods (heat pipes and heat sinks)
Solution Approach 2:
The patent replaces the mechanical fan-based active cooling system with a passive thermal conduction system using heat pipes and heat sinks, substituting mechanical movement with thermal physics principles to achieve dust-free cooling
2Temperature
If heat dissipation coating with high thermal conductivity is applied, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs a composite heat dissipation coating containing aluminum oxide nanoparticles dispersed in a polymer matrix, combining the high thermal conductivity of ceramic particles with the processability of polymer materials to achieve both performance and manufacturability
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the coating by controlling nanoparticle concentration and distribution, achieving optimal heat dissipation while maintaining ease of application through standard coating processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the surface temperature to within regulatory limits (e.g., 56°C in Japan) and ensures the device remains waterproof, preventing rust and extending its service life by improving heat dissipation and preventing dust accumulation.
Implementation Method 1
The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing
Implementation Method 2
the heat pipes are in thermal contacts with the thermal conductive casing
Implementation Method 3
the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes
Implementation Method 4
The heat absorbing block is in thermal contacts with the identity recognition module
Data Source
AI summary
The disclosure is related to an identity recognition device. The identity recognition device includes a thermal conductive casing, an identity recognition module, a heat dissipation assembly, and a heat dissipation coating. The heat dissipation assembly includes a plurality of heat pipes, a heat absorbing block and a first heat sink. The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing. The heat absorbing block is in thermal contacts with the identity recognition module, and two opposite sides of the first heat sink respectively are in thermal contacts with the heat pipes and the heat absorbing block. The heat dissipation coating is coated on the thermal conductive casing and the heat pipes, wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes.