Idle-Mode Temperature Control to Prevent PCB Solder Cracks
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Solution Overview
Problem
Solder crack failure in electronic products, caused by mechanical and thermal stresses, leads to electrical disconnections or short circuits, rendering the product unusable.
Innovation Solution
A protecting method that activates a mechanism to control the electronic product's operating temperature by entering and leaving an idle mode, thereby reducing the temperature drop rate and mitigating solder crack failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the electronic product operates continuously at high temperature, then productivity is improved, but solder crack failure occurs due to thermal stress
Solution Approach 1:
The patent implements periodic idle modes where the electronic product temporarily suspends high-temperature operations. The controller periodically enters idle states to allow temperature recovery, preventing cumulative thermal stress on solder joints while maintaining overall productivity through structured operation cycles.
Solution Approach 2:
The patent dynamically changes the operating temperature parameter by transitioning between active and idle states. The controller monitors temperature and adjusts operational parameters accordingly, reducing temperature during idle periods to prevent solder crack failure while maintaining high temperature during active periods for productivity.
2Object-affected harmful factors
If the operating temperature is rapidly reduced, then thermal stress on solder material is relieved, but thermal shock may cause new damage
Solution Approach 1:
The patent implements dynamic temperature control where the cooling rate is adjusted based on real-time temperature monitoring. The controller dynamically modifies the idle mode duration and intensity to achieve gradual temperature reduction, balancing thermal stress relief with prevention of thermal shock damage to solder joints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents solder crack failure by gradually reducing the operating temperature, thereby extending the product's lifespan and ensuring normal operation.
Implementation Method 1
When the operating temperature of the electronic product reaches a first operating temperature, the protecting mechanism is activated to control a number of times of allowing the electronic product to enter an idle mode and to control a time length in the idle mode, so that the operating temperature of the electronic product is reduced at a first average drop rate
Data Source
AI summary
A protecting method for preventing solder crack failure in an electronic product is provided. Firstly, a step (a) is performed to confirm that a crack incidence rate of a metallic solder material in a printed circuit board is high. In a step (b), a protecting mechanism of controlling the electronic product to enter an idle mode and leave the idle mode is activated. Consequently, an operating temperature of the electronic product decreases at a first average drop rate.