IF Frequency-Translated BPF for SAW-Less Receiver Integration
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Solution Overview
Problem
The existing wireless communication devices require expensive discrete components like SAW filters, duplexers, and inductors to meet performance standards for 2G and 3G protocols, which are not scalable with advancements in IC fabrication, leading to redesign challenges for transceiver ICs.
Innovation Solution
The implementation of a SAW-less receiver and transmitter architecture that incorporates frequency translated bandpass filters (FTBPF) and power amplifier drivers within a system on a chip (SoC), eliminating the need for discrete off-chip components and enabling scalability with IC process updates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete SAW filters, duplexers, and inductors are used to meet performance standards, then communication reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple discrete filtering functions (SAW filters, duplexers, inductors) into a single integrated bandpass filter circuit that is directly coupled to the LNA output. This merging eliminates the need for separate discrete components while maintaining the required filtering performance for 2G and 3G protocols, thereby reducing device complexity without sacrificing communication reliability.
Solution Approach 2:
The integrated bandpass filter circuit is designed to perform multiple functions simultaneously: it provides filtering for both 2G and 3G frequency bands, acts as a duperex by separating transmit and receive paths, and integrates with the LNA and power amplifier stages. This multi-functionality replaces multiple specialized discrete components with a single universal filter circuit.
2Manufacturing precision
If discrete off-chip components are used, then performance standards are met, but scalability with IC fabrication advancements is reduced
Solution Approach 1:
The patent integrates the bandpass filter circuit directly into the IC chip, merging previously discrete off-chip components (SAW filters, inductors, capacitors) into on-chip implementations. This integration allows the filter design to scale with IC fabrication process improvements, enabling better performance and lower cost as manufacturing technology advances, while still meeting required performance standards through careful circuit design.
3Manufacturing precision
If multiple discrete filtering components are used, then signal filtering performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent consolidates multiple discrete filtering components into a single integrated bandpass filter circuit that can be manufactured as part of the IC fabrication process. This reduces the bill of materials by eliminating separate SAW filters, inductors, and capacitors, while maintaining signal filtering performance through optimized on-chip circuit design that provides the necessary frequency selectivity for multiple communication standards.
Solution Approach 2:
The integrated filter circuit is designed to provide universal filtering capability across multiple frequency bands (2G and 3G) and multiple communication standards, replacing the need for separate filtering components for each band. This multi-functional design reduces manufacturing complexity and cost while maintaining the required signal filtering performance.
Data Source
AI summary
A SAW-less receiver includes an FEM interface module, an RF to IF receiver section, and a receiver IF to baseband section. The RF to IF receiver section includes a mixing module, a mixed buffer section, and a frequency translated BPF (FTBPF) circuit module. The mixing module converts an inbound RF signal into an in-phase (I) mixed signal and a quadrature (Q) mixed signal. The mixed buffer section filters and buffers the I mixed signal and filter and buffer the Q mixed signal. The FTBPF circuit module frequency translates a baseband filter response to an IF filter response such that the FTBPF circuit module filters undesired signal components of the IF I signal and the IF Q signal to produce an inbound IF signal. The receiver IF to baseband section converts the inbound IF signal into one or more inbound symbol streams.