Integrated IGBT and AC Switch Module for Power Supply

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Solution Overview

Problem

Conventional power semiconductor modules for 3-phase inverters require a large number of electrical conductors with complex shapes, leading to increased inductance and higher peak voltages when IGBTs are turned off, necessitating high-voltage tolerant chips and larger, more costly modules.

Innovation Solution

The integration of IGBTs and semiconductor AC switches into a single package eliminates the need for conductors between IGBTs, reducing wire inductance and peak voltages, and allows for a more compact and cost-effective design by arranging terminals linearly and using reverse parallel connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If IGBTs and AC switches are connected using multiple electrical conductors in conventional modules, then the module can be assembled with separate components, but the wire inductance increases and peak voltages rise when IGBTs are turned off

Engineering Contradiction:

Improveassembly flexibilityVSAvoidpeak voltage and wire inductance

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent combines multiple IGBTs and AC switches into a single integrated power semiconductor module package, eliminating the need for external electrical conductors to connect these components. This integration directly reduces wire inductance and the associated peak voltages when IGBTs are turned off, while maintaining assembly flexibility through the modular package design.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If high-voltage tolerant IGBT chips are used to handle peak voltages, then the module can withstand voltage spikes, but the module size and cost increase

Engineering Contradiction:

Improvevoltage toleranceVSAvoidmodule size

Core Design Contradiction:

ReliabilityVSWeight of stationary object

Solution Approach 1:

By integrating multiple IGBTs and AC switches within a single module package with internal direct connections, the patent reduces wire inductance and minimizes peak voltage generation. This allows the use of IGBT chips with lower voltage ratings while maintaining system reliability, thereby reducing module size and cost.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If multiple electrical conductors with complex shapes are used to connect IGBTs, then the circuit can be implemented, but the inductance increases and manufacturing complexity rises

Engineering Contradiction:

Improvecircuit implementationVSAvoidconductor configuration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent integrates all IGBTs and AC switches within a single module package with internal direct connections, completely eliminating the need for external electrical conductors. This simplifies the circuit implementation while reducing inductance and manufacturing complexity, as no external wire routing or complex conductor configurations are required.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8300443B2Semiconductor module for use in power supply

Publication Date: 2012.10.30 FUJI ELECTRIC CO LTD

AI summary

A series connection circuit of IGBTs and an AC switch are contained in one package. The series connection circuit is connected between the positive and negative terminals of a DC power source, and the AC switch is connected between a neutral point of the DC power source and a series connection point between the IGBTs. Straight conductor strips can be used to connect terminals on the package to the DC power source, thereby reducing inductance and thus also reducing voltage spikes.