IGBT Current Suppressing Layer for Voltage Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Silicon carbide (SiC) bipolar devices face challenges with forward voltage degradation over time due to Basal Plane Dislocations, leading to increased on-resistance and power dissipation at high temperatures, especially for high voltage applications above 10 kV.
Innovation Solution
The development of an insulated gate bipolar transistor (IGBT) with a current suppressing layer having a higher doping concentration than the drift layer, combined with an epitaxial structure, to reduce forward voltage drop and maintain high blocking capability, achieved through specific doping concentrations and layer thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If bipolar operation is used to reduce drift layer resistance via conductivity modulation, then forward voltage drop is reduced, but forward voltage degradation over time occurs due to Basal Plane Dislocations
Solution Approach 1:
A current suppressing layer is introduced as an intermediary component between the drift layer and the emitter. This layer has higher doping concentration than the drift layer, which allows it to suppress the harmful effects of Basal Plane Dislocations while maintaining the beneficial conductivity modulation effect for reducing forward voltage drop.
Solution Approach 2:
The current suppressing layer is positioned locally in the device structure where it can specifically address the dislocation issues without affecting the overall bipolar operation. The layer has distinct local properties (higher doping concentration) that differ from the drift layer, allowing targeted suppression of current conduction paths affected by BPDs.
2Strength
If drift layer thickness is increased to achieve higher blocking voltage capability, then blocking voltage is improved, but on-resistance increases substantially
Solution Approach 1:
The doping concentration parameter of the current suppressing layer is changed to be higher than that of the drift layer. This parameter change allows the device to maintain low on-resistance even with thick drift layers required for high blocking voltage, by compensating for the resistance increase through the highly doped suppressing layer.
3Strength
If drift layer thickness is increased for higher blocking voltage, then blocking voltage is improved, but power dissipation increases at high temperatures due to bulk mobility reduction
Solution Approach 1:
The current suppressing layer acts as an intermediary that mitigates the temperature-dependent mobility reduction effects. By having higher doping concentration, this layer provides a more stable conduction path that is less sensitive to temperature-induced bulk mobility changes, thereby reducing power dissipation at high temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IGBT design achieves a significant reduction in forward voltage drop and on-resistance, enhancing power switching applications by suppressing current conduction and maintaining high blocking voltage, even at elevated temperatures.
Implementation Method 1
bipolar operation to reduce the drift layer resistance via conductivity modulation resulting from injected minority carriers
Implementation Method 2
maintaining high blocking capability, achieved through specific doping concentrations and layer thicknesses
Data Source
AI summary
An insulated gate bipolar transistor (IGBT) includes a first conductivity type substrate and a second conductivity type drift layer on the substrate. The second conductivity type is opposite the first conductivity type. The IGBT further includes a current suppressing layer on the drift layer. The current suppressing layer has the second conductivity type and has a doping concentration that is larger than a doping concentration of the drift layer. A first conductivity type well region is in the current suppressing layer. The well region has a junction depth that is less than a thickness of the current suppressing layer, and the current suppressing layer extends laterally beneath the well region. A second conductivity type emitter region is in the well region.


