IGBT and Diode Power Module for SR Motor Control
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Solution Overview
Problem
Current electronic apparatuses controlling switched reluctance motors (SR motors) face challenges in achieving high performance and downsizing, particularly due to differences in inverter circuit configurations compared to those for permanent magnet motors (PM motors), leading to inefficiencies and reliability issues.
Innovation Solution
A semiconductor device is designed with a single package configuration, incorporating a first chip mounting portion for an IGBT and a second chip mounting portion for a diode, both electrically separated, and connected via conductive members, integrated into a power module for SR motor applications, enhancing heat dissipation and reducing heat loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a single package configuration is used for both IGBT and diode chip mounting portions, then device integration and compactness are improved, but electrical isolation and heat dissipation performance may deteriorate
Solution Approach 1:
The single package is segmented into first and second chip mounting portions that are electrically isolated from each other. The first chip mounting portion mounts the IGBT chip while the second chip mounting portion mounts the diode chip, with electrical isolation structures preventing electrical interference between the two semiconductor devices within the same package.
2Volume of moving object
If IGBT and diode are mounted in the same package, then device downsizing is achieved, but heat loss and thermal management become problematic
Solution Approach 1:
The package is divided into separate first and second chip mounting portions with independent thermal pathways. Each semiconductor chip (IGBT and diode) has its own heat dissipation route, allowing optimized thermal management for each device while maintaining compact packaging.
Solution Approach 2:
Different thermal management approaches are applied to different regions of the package. The first chip mounting portion and second chip mounting portion have independent heat dissipation structures tailored to the specific thermal requirements of each semiconductor device, with local optimization of thermal conductivity and heat sink design.
3Reliability
If electrical separation is implemented between chip mounting portions, then reliability is improved, but device complexity increases
Solution Approach 1:
The package structure is segmented into distinct first and second chip mounting portions with built-in electrical isolation. The isolation structures are integrated into the package design itself rather than added as separate components, achieving electrical separation while maintaining relatively simple overall package geometry and manufacturing processes.
Data Source
AI summary
An electronic apparatus includes a wiring board including a main surface on which a first wiring and a second wiring are formed, a first semiconductor device mounted on the main surface of the wiring board, and a second semiconductor device mounted on the main surface of the wiring board. Each of the first semiconductor device and the second semiconductor device includes a first semiconductor chip including an insulated gate bipolar transistor, a second semiconductor chip including a diode, a first lead electrically connected to an emitter electrode pad formed on a first front surface of the first semiconductor chip, a second lead electrically connected to an anode electrode pad formed on a second front surface of the second semiconductor chip, and a first terminal electrically connected to a collector electrode formed on a first back surface of the first semiconductor chip.