IGBT ESD Protection Structure With Low Capacitance Triggering

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Solution Overview

Problem

Existing data transmission systems face challenges with electrostatic discharge (ESD) protection due to high trigger voltages and capacitance issues, which can lead to component damage during ESD events, and current solutions like semiconductor controlled rectifiers (SCRs) do not adequately address these problems.

Innovation Solution

An insulated-gate bipolar transistor (IGBT) device with a specific doping structure and antiparallel diode configuration is proposed, which reduces capacitance, tunes breakdown voltage, and avoids voltage snapback, allowing for effective ESD protection with lower trigger voltage and higher current density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a MOSFET is used for ESD protection, then the device can avoid voltage snapback, but the device capacitance becomes very high due to size and gate oxide

Engineering Contradiction:
Improvevoltage snapback avoidanceVSAvoiddevice capacitance
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The device is segmented into two functional parts: an IGBT structure for snapback avoidance and antiparallel diodes for capacitance reduction. The IGBT is divided into specific doped regions (first region with first charge carriers, second region with second charge carriers, third region with first charge carriers, fourth region with second charge carriers) that work together to prevent snapback while the antiparallel diode structure masks the gate oxide capacitance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines different semiconductor structures (IGBT and diodes) into a composite device that leverages the advantages of each component. The IGBT portion provides snapback-free operation while the antiparallel diodes provide low capacitance, creating a hybrid structure that resolves the contradiction between reliability and capacitance.

Inventive Principle:
Principle #40Composite materials

2Reliability

If external triggering is used to reduce trigger voltage in SCR, then trigger voltage decreases, but device complexity and capacitance increase

Engineering Contradiction:
Improvetrigger voltageVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the triggering function from external components and integrates it into the device structure itself. The gate structure is positioned adjacent to the second and fourth regions, allowing direct control of the IGBT without requiring external triggering circuits, thereby reducing both complexity and additional capacitance.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the triggering mechanism with the main protective device structure. The gate structure is integrated adjacent to the doped regions, combining the control function with the protective function in a single unified device rather than separate components.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If diode strings are used to create trigger current, then trigger voltage reduces, but device capacitance increases

Engineering Contradiction:
Improvetrigger voltageVSAvoiddevice capacitance
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent changes the electrical parameters of the device by using specific doping configurations in the four regions. The doped regions create internal electric fields and potential distributions that enable low trigger voltage operation without requiring additional capacitive structures like diode strings.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The IGBT device functions as a stand-alone ESD protection or trigger, reducing overall capacitance and enabling efficient dissipation of ESD events, thereby protecting data transmission system components from damage.

Implementation Method 1

a first region doped with a first type of charge carriers; a second region doped with a second type of charge carriers different from the first type of charge carriers; a third region doped with the first type of charge carriers; a fourth region doped with the second type of charge carriers

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

When an ESD event occurs in a data transmission system, components of the data transmission system may be damaged if the discharge is not suitably dissipated by the system

Methodology Applied
Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS20240258300A1Insulated-gate bipolar transistor device as well as a data transmission system implementing such insulated-gate bipolar transistor device
Publication Date: 2024.08.01 NEXPERIA BV
  • US20240258300A1 patent drawing
  • US20240258300A1 patent drawing
  • US20240258300A1 patent drawing

AI summary

An insulated-gate bipolar transistor device is provided including: a first region doped with a first type of charge carriers; a second region doped with a second type of charge carriers different from the first type of charge carriers; a third region doped with the first type of charge carriers; a fourth region doped with the second type of charge carriers; a first, emitter terminal electrically connected with the first region and a second, collector terminal electrically connected with the third region and the fourth region; and a gate structure disposed on the third region with one end adjacent to the second region and with another end adjacent the fourth region; as well as a diode structure having a first diode structure terminal electrically connected with the collector terminal and a second diode structure terminal electrically connected with the gate terminal of the gate structure.