IGBT Module Heat Dissipation via Solder-Layer Elimination
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Solution Overview
Problem
Conventional IGBT modules with DBC substrates suffer from limited heat dissipation efficiency due to inadequate heat transfer and high interface impedance caused by empty soldering in the solder layer, leading to potential damage from excessive temperature.
Innovation Solution
An improved IGBT module structure featuring a thermal spray layer of ceramic material, a polymer composite layer, and a thick copper layer, which directly bonds to the heat dissipation layer without a solder layer, enhancing heat conduction and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a DBC substrate with solder layer is used for heat dissipation, then the IGBT chip can be mounted and heat can be transferred, but the solder layer experiences empty soldering phenomenon causing increased interface impedance and reduced heat dissipation efficiency
Solution Approach 1:
The patent removes the solder layer from the heat dissipation path between the DBC substrate and heat dissipation layer. By eliminating this problematic intermediate layer that causes empty soldering and interface impedance, the invention directly connects the DBC substrate to the heat dissipation layer, thereby resolving the reliability issue while maintaining the mounting function.
Solution Approach 2:
The patent employs a composite structure combining DBC substrate with integrated thick copper layers and ceramic materials. This composite design integrates multiple functions (electrical connection, thermal conduction, mechanical support) into a unified structure that eliminates the need for separate solder layers and improves overall heat dissipation efficiency.
2Temperature
If a conventional DBC substrate is used, then the IGBT chip mounting is achieved, but the heat transfer capability is limited and cannot dissipate heat in time
Solution Approach 1:
The patent applies local quality enhancement by incorporating thick copper layers (greater than 100 μm) specifically in the heat dissipation regions of the DBC substrate. This localized improvement of thermal conductivity in critical areas enables more efficient heat transfer from the IGBT chip to the heat dissipation layer, addressing the temperature control issue without requiring complete redesign of the entire substrate.
Solution Approach 2:
The patent changes the thickness parameter of the copper layer from conventional thin layers to thick layers (greater than 100 μm). This parameter change significantly enhances the thermal conductivity and heat capacity of the substrate, enabling it to rapidly transfer heat away from the IGBT chip and prevent temperature buildup.
3Reliability
If the connection between DBC substrate and heat dissipation layer is made through solder layer, then electrical connection is achieved, but the interface impedance increases and thermal conductivity effectiveness is reduced
Solution Approach 1:
The patent extracts and removes the solder layer from the connection interface between the DBC substrate and heat dissipation layer. This elimination of the intermediate solder layer eliminates the source of interface impedance and thermal resistance, achieving both reliable electrical connection and effective thermal conduction without energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses heat dissipation issues by eliminating interface impedance and empty soldering problems, achieving superior heat absorption and dissipation performance with improved thermal conductivity and uniformity.
Implementation Method 1
The thermal spray layer is disposed on the heat dissipation layer... The thermal spray layer has a thickness of about 20-500 μm... achieving superior heat absorption and dissipation performance with improved thermal conductivity
Implementation Method 2
the polymer composite layer is bonded onto the thermal spray layer by screen printing or hot pressing
Implementation Method 3
the thick copper layer is bonded onto the polymer composite layer by hot pressing
Implementation Method 4
the heat generated by the high-power inverters during operation will cause the IGBT chip temperature to rise... achieving superior heat absorption and dissipation performance
Data Source
AI summary
An IGBT module with an improved heat dissipation structure includes a layer of IGBT chips, a bonding layer, a thick copper layer, a polymer composite layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on the heat dissipation layer. The polymer composite layer is disposed on the thermal spray layer. The thick copper layer is disposed on the polymer composite layer. The bonding layer is disposed on the thick copper layer. The layer of IGBT chips is disposed on the bonding layer.