IGBT Electrode Pad Shapes for Easier Testing and Uniform Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices, such as IGBTs, face challenges in easily distinguishing between multiple electrode pads, which can lead to difficulties in chip testing and uneven pressure application during mounting.
Innovation Solution
The semiconductor device incorporates first and second electrode pads with distinct planar shapes, arranged in a point-symmetric configuration on the diagonal of the chip, allowing easy discrimination and uniform pressure application during mounting, while also enabling efficient discharge of holes and reducing power loss through differential capacitance and resistance settings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electrode pads are provided in a semiconductor device, then the device functionality is improved, but it becomes difficult to distinguish between the electrode pads
Solution Approach 1:
The patent applies asymmetry by giving the first electrode pad a different planar shape from the second electrode pad. Specifically, the first electrode pad has a first planar shape while the second electrode pad has a second planar shape that differs from the first, making them easily distinguishable during mounting and testing operations.
2Device complexity
If electrode pads have similar appearances, then the device structure is simplified, but mounting and testing become difficult
Solution Approach 1:
The patent introduces asymmetry in the planar shapes of electrode pads to improve ease of operation during mounting and testing. The first electrode pad and second electrode pad have different planar shapes, allowing operators to easily distinguish and correctly position them without increasing overall device complexity.
3Reliability
If pressure is applied during mounting, then electrical connection is ensured, but non-uniform pressure increases power loss
Solution Approach 1:
The patent uses asymmetric planar shapes of electrode pads to enable uniform pressure distribution during mounting. The different shapes are designed to work with the mounting structure to ensure that pressure is applied uniformly across the electrode pads, maintaining reliable electrical connection while minimizing power loss.
Data Source
AI summary
A semiconductor device includes first and second electrodes, first to fourth semiconductor regions, first and second control electrodes, and first and second electrode pads. The first semiconductor region is located on the first electrode. The second semiconductor region is located on the first semiconductor region. The third semiconductor region is located on the second semiconductor region. The fourth semiconductor region is located on a portion of the third semiconductor region. The first control electrode faces the second, third, and fourth semiconductor regions via a first insulating film. The second control electrode faces the second and third semiconductor regions via a second insulating film. The first electrode pad is electrically connected with the first control electrode. The second electrode pad is electrically connected with the second control electrode. The second electrode pad has a different planar shape from the first electrode pad.