IGBT Temperature Sensor and Control Circuit for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power electronic devices, such as IGBTs used in electric and hybrid vehicles, generate excessive heat, requiring an effective cooling system to prevent temperature overload and ensure reliable operation.
Innovation Solution
A cooling system incorporating a temperature sensor and control circuit to monitor and reduce current to the inverter circuit when temperatures exceed a predetermined level, coupled with a substrate assembly featuring ceramic wafers and metal layers for efficient heat management and temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If IGBTs operate at high power to supply AC motors, then power output is improved, but heat generation increases causing temperature to exceed safe operating limits
Solution Approach 1:
The patent implements a feedback mechanism where temperature sensors continuously monitor the temperature of IGBTs and provide signals to a control circuit. When the temperature exceeds a predetermined threshold, the control circuit automatically reduces the current to the inverter circuit, thereby reducing power output and heat generation. This closed-loop feedback system dynamically balances power output and temperature control.
Solution Approach 2:
The patent introduces a substrate assembly with ceramic layers as a thermal intermediary between the IGBTs and the cooling system. The ceramic substrate provides a thermal pathway that conducts heat away from the IGBTs while maintaining electrical isolation. This intermediary structure enables efficient heat management without interfering with the high-power operation of the IGBTs.
2Temperature
If cooling systems are added to control temperature, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges the temperature sensing, signal processing, and current control functions into an integrated control circuit that works in conjunction with the substrate assembly. The temperature sensors are positioned to directly monitor IGBT temperatures, and the control circuit is integrated with the existing power electronics architecture. This merging approach achieves effective temperature control while minimizing the addition of separate, complex cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively controls temperature in power electronic devices, preventing overheating and ensuring reliable operation by reducing current when high temperatures are detected, thereby extending the lifespan and performance of IGBTs in automotive applications.
Implementation Method 1
A temperature sensor is coupled to the second ceramic layer. The temperature sensor is configured to measure the temperature of the semiconductor switching device.
Implementation Method 2
The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature.
Implementation Method 3
A substrate assembly featuring ceramic wafers and metal layers for efficient heat management
Data Source
AI summary
A cooling system is provided for controlling temperature in a power electronic device. The power electronic device includes a semiconductor having a major surface. The cooling system includes a temperature sensor coupled to the major surface of the semiconductor; and a control circuit coupled the temperature sensor. The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature.