IGCT Gate Pressure Ring Assembly for Easier Alignment
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Solution Overview
Problem
The increasing size and complexity of Integrated Gate Commutated Thyristors (IGCTs) due to higher current ratings lead to increased housing size and cost, along with challenges in proper alignment and mounting of large-area devices during transport and assembly.
Innovation Solution
A semiconductor switching device with a pressure system comprising an insulating ring and spring beams, featuring a segmented design with supports and pins for secure alignment and assembly, allowing for a single-piece assembly that simplifies installation and reduces complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the current rating of IGCT is increased, then the maximal controllable turn-off current is improved, but the wafer size and housing size increase leading to higher complexity and costs
Solution Approach 1:
The pressure system is divided into multiple spring beams arranged circumferentially on an insulating ring, with each spring beam independently supporting gate connector element fingers. This segmentation allows distributed pressure application across the gate ring while maintaining manageable component sizes and simplifying assembly.
2Power
If the wafer size is increased to handle higher currents, then the current carrying capacity is improved, but the mounting and alignment difficulty increases
Solution Approach 1:
The gate connector element fingers are pre-formed with bends that correspond to the positions of the spring beams. This preliminary shaping ensures that when the pressure system is assembled, the fingers naturally align with the spring beams, facilitating easy assembly without requiring complex alignment procedures during mounting.
Solution Approach 2:
The spring beams automatically apply pressure to the gate connector element fingers through their elastic deformation. The system self-adjusts to maintain proper contact pressure without requiring external adjustment mechanisms, simplifying the mounting process and ensuring reliable electrical contact.
3Productivity
If multiple devices are stacked for transport, then the shipping efficiency is improved, but the pressure distribution and contact stability become more difficult to ensure
Solution Approach 1:
The spring beams provide dynamic pressure application through their elastic properties. When devices are stacked during transport, the spring beams automatically adjust their deflection to maintain consistent contact pressure on the gate ring, ensuring stable electrical contact despite external forces from stacking and handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient, cost-effective assembly and alignment of IGCTs, reducing housing size and complexity while ensuring proper contact and stability during transport and operation.
Implementation Method 1
a plurality of spring beams arranged circumferentially on the insulating ring
Data Source
Figure 1~2A
Figure 2B~3
Figure 4A~5B
AI summary
A semiconductor switching device (1) comprises a gate ring (5) and a gate connector element (6) for contacting the gate ring (5) and comprises a pressure system (7) for pressing the gate connector element (6) onto the gate ring (5), the pressure system (7) comprising an insulating ring (11) and a plurality of spring beams (12) arranged circumferentially on the insulating ring (11), wherein the insulating ring (11) comprises a plurality of supports (16, 17) for supporting ends (14, 15) of the spring beams (12).