Igniter Assembly IC Tag Nesting for Airbag Quality Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing igniter assemblies for airbag systems are too small to accommodate conventional labeling or identification methods, making it difficult to manage and track manufacturing information, which is crucial for quality control and failure analysis, and the IC tags in previous designs are not protected by the metallic shield, rendering them vulnerable to impact during airbag deployment.
Innovation Solution
Incorporating an IC tag into the igniter assembly within the metallic shield vessel, in close proximity to the conductive pins, allows for the embedding of production and shipping information, enabling quality control and failure analysis while ensuring the IC tag is protected from impact and heat during airbag deployment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If conventional labeling methods (barcodes or imprints) are used on the igniter assembly, then manufacturing information can be recorded, but the igniter assembly is too small to accommodate these labels and the imprints are too small to be visually recognized
Solution Approach 1:
The IC tag is embedded within the insulating layer of the igniter assembly, nesting the identification component inside the existing structure rather than adding external labels. This allows manufacturing information to be stored within the igniter's volume without increasing its external dimensions.
Solution Approach 2:
The patent replaces mechanical labeling methods (barcodes, imprints) with an electronic identification system (IC tag). This substitution enables information storage and retrieval without requiring physical space for labels, solving the contradiction between information tracking and compact size.
2Ease of operation
If the IC tag is disposed outside the airbag housing body as in previous designs, then the airbag can be connected contactlessly, but the IC tag is not protected by the metallic shield and is vulnerable to impact during airbag deployment
Solution Approach 1:
The IC tag is merged with the igniter assembly and positioned within the metallic shield vessel. This combination ensures that the IC tag inherits the protective function of the metallic shield while maintaining its identification function, resolving the contradiction between ease of operation and reliability.
Solution Approach 2:
The metallic shield provides beforehand protection to the IC tag against impact and heat during airbag deployment. By positioning the IC tag within the shield before deployment, the system ensures the tag is protected from environmental stresses that would otherwise damage externally positioned tags.
3Reliability
If the IC tag is embedded in the insulating layer within the metallic shield, then the IC tag is protected from impact and heat, but the detection of the IC tag becomes more difficult due to the insulating material
Solution Approach 1:
The reader/writer device is positioned at a specific location where the insulating layer is thinner or absent, creating a local detection window. This allows electromagnetic waves to penetrate the insulating material and detect the IC tag without compromising the overall protection provided by the insulating layer.
Solution Approach 2:
The metallic shield acts as an intermediary that allows electromagnetic detection while providing mechanical and thermal protection. The shield's electromagnetic properties enable the reader/writer to detect the IC tag through or near the shield structure without removing the protective barrier.
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
This igniter has a heating element, an ignition agent positioned so as to be in contact with the heating element, and conductive pins that pass through an insulating layer, and are electrically connected to the heating element. One end of each conductive pin is exposed through the insulating layer in such a manner that a current supply component, which supplies an ignition current, is connected to the heating element. An IC tag is positioned inside the insulating layer, in the vicinity of the conductive pins.