IGZO TFT Conductive Wire Gap for ESD Charge Discharge

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The high incidence of Electro-Static Discharge (ESD) in the manufacturing of IGZO-based Thin Film Transistor (TFT) devices leads to charge accumulation, which can break down insulating layers and cause short-circuiting, as existing methods to mitigate ESD do not provide an effective discharging path and can lead to further static electricity accumulation.

Innovation Solution

A conductive wire structure with a gap between the first and second conductive wires, where an electrical connector connects the wires' ends, with a part of the connector located on a different plane, allowing for effective discharge of accumulated charges through the gap, thereby preventing short-circuiting and improving product yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive wires are continuously connected without gaps, then electrical connectivity is maintained, but charges accumulate causing ESD damage and short-circuiting

Engineering Contradiction:
Improvedevice reliabilityVSAvoidcharge accumulation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The conductive wire is divided into multiple segments (first conductive wire and second conductive wire) separated by a gap. This segmentation allows the wire to maintain electrical connectivity through the electrical connector while providing a discharge path for accumulated charges, preventing ESD damage to the IGZO TFT device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An electrical connector is introduced as an intermediary component between the first and second conductive wires. This connector provides both electrical connectivity and a controlled discharge path, mediating between the need for continuous electrical connection and the need to prevent charge accumulation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If a gap is introduced between conductive wires to discharge charges, then ESD protection is improved, but electrical connectivity may be compromised

Engineering Contradiction:
ImproveESD protectionVSAvoidelectrical connectivity
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The electrical connector extends from the first plane (where the gap exists) to a second plane, utilizing a third dimension to bridge the gap. This dimensional transition allows electrical connectivity to be maintained despite the physical gap between conductive wire segments on the same plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If existing ESD mitigation methods are used without effective discharging paths, then manufacturing complexity is reduced, but charge accumulation continues causing short-circuiting

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidshort-circuiting risk
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The electrical connector merges multiple functions into a single component: it provides electrical connectivity between conductive wire segments, establishes a discharge path for accumulated charges, and maintains structural integrity. This integration achieves ESD protection without significantly increasing manufacturing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution effectively discharges accumulated charges, preventing damage to insulating layers and reducing the risk of short-circuiting, thereby enhancing the reliability and yield of IGZO-based TFT devices.

Implementation Method 1

a connection end of the first conductive wire is spaced apart from a connection end of the second conductive wire by a gap so as to discharge charges accumulated on the first conductive wire and the second conductive wire through the gap

Methodology Applied
Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS11088180B2Conductive wire structure and manufacturing method thereof, array substrate and display device
Publication Date: 2021.08.10 HEFEI BOE OPTOELECTRONIC TECH CO LTD
  • US11088180B2 patent drawing
  • US11088180B2 patent drawing
  • US11088180B2 patent drawing

AI summary

The present disclosure provides a conductive wire structure, a manufacturing method thereof, an array substrate and a display device. The conductive wire structure includes a first conductive wire and a second conductive wire on a first plane, wherein a connection end of the first conductive wire is spaced apart from a connection end of the second conductive wire by a gap so as to discharge charges accumulated on the first conductive wire and the second conductive wire through the gap; an electrical connector connected to the connection end of the first conductive wire and the connection end of the second conductive wire, respectively, wherein a part of the electrical connector is located on a second plane different from the first plane.