IHS Boiling Enhancement Mesh for Low-Resistance Immersion Cooling
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Solution Overview
Problem
Existing semiconductor chip packaging structures for immersion cooling systems face inefficiencies in heat transfer due to multiple thermal interface layers and additional components, which increase thermal resistance and complexity.
Innovation Solution
A simplified structure with a direct attachment of thin copper or metal meshing to the integrated heat spreader (IHS) of the semiconductor chip package, promoting bubble nucleation and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple thermal interface layers and additional components are used in semiconductor chip packaging structures, then the structure can accommodate various components and interfaces, but thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
The patent removes multiple thermal interface layers and intermediate components from the heat transfer path between the semiconductor chip and the heat sink. By extracting these unnecessary layers, the invention achieves direct thermal contact, significantly reducing thermal resistance and improving heat transfer efficiency while simplifying the overall structure.
Solution Approach 2:
The invention merges the thermal interface function directly into the heat sink structure itself, eliminating the need for separate thermal interface layers. The heat sink is designed to make direct contact with the semiconductor chip, combining the heat dissipation and thermal conduction functions into a single integrated component.
2Reliability
If traditional immersion cooling structures are used, then cooling coverage is provided, but thermal resistance remains high and cooling capability is limited
Solution Approach 1:
The patent utilizes phase transition of the immersion cooling fluid (boiling and condensation) to enhance heat transfer. The heat sink structure promotes bubble nucleation and phase change at the liquid-vapor interface, leveraging the high latent heat of vaporization to dramatically increase cooling capability and reduce thermal resistance compared to single-phase liquid cooling.
Solution Approach 2:
The invention transitions from single-phase liquid cooling to two-phase cooling by utilizing the vapor phase in addition to the liquid phase. This dimensional change in the cooling medium's state allows for much higher heat flux and improved thermal management performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves lower thermal resistance (as low as 0.042 C°/W) and higher cooling capability compared to prior art, while also reducing complexity and cost.
Implementation Method 1
promoting bubble nucleation
Implementation Method 2
the liquid in the thermal bath 102 boils and converts from a liquid to a vapor
Implementation Method 3
The boiling activity corresponds to a phase transition in the liquid (from liquid to gas)
Implementation Method 4
heat from the operating semiconductor chips is transferred from the electronic system to the immersion bath
Data Source
AI summary
An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.