III-Nitride Doping During Growth to Prevent Nitrogen Loss
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Solution Overview
Problem
The challenge in III-nitride device fabrication is maintaining stoichiometry, particularly at high temperatures where nitrogen can escape, leading to decomposition during annealing after implantation, which complicates the formation of PN junctions.
Innovation Solution
Doping a III-nitride body during growth using an implanter within a reactor chamber, maintaining a near-vacuum environment and low energy implantation to prevent decomposition, allowing for the creation of doped III-nitride bodies without the need for high-temperature annealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperature annealing is performed after implantation to activate dopants, then dopant activation is improved, but nitrogen loss and decomposition of the III-nitride body occur
Solution Approach 1:
The patent applies preliminary action by performing implantation during the growth process rather than after complete growth and annealing. The dopant is introduced in advance during the formation of the III-nitride layer, eliminating the need for subsequent high-temperature annealing that would cause nitrogen loss. This resolves the contradiction by achieving dopant incorporation without the harmful high-temperature treatment.
Solution Approach 2:
The patent changes the temperature parameter by conducting implantation at lower temperatures during growth rather than performing high-temperature annealing afterward. By modifying the thermal conditions and timing of dopant introduction, the process achieves effective doping while avoiding nitrogen decomposition, thus resolving the contradiction between dopant activation and nitrogen retention.
2Manufacturing precision
If implantation is performed in vacuum environment, then dopant precision is improved, but gas pressure required for III-nitride growth is compromised
Solution Approach 1:
The patent applies segmentation by dividing the reactor chamber into distinct pressure zones - a vacuum region for precise ion implantation and a higher pressure region for III-nitride growth. This spatial segmentation allows both vacuum-based precise implantation and gas-pressure-based growth to occur simultaneously in different areas of the same chamber, resolving the contradiction between implantation precision and growth conditions.
Solution Approach 2:
The patent uses differential pumping as an intermediary mechanism to bridge the vacuum environment required for implantation and the gas environment required for growth. The differential pumping system creates and maintains different pressure conditions in different regions of the chamber, enabling both processes to coexist without direct conflict, thus resolving the contradiction between vacuum precision and gas pressure growth.
3Manufacturing precision
If low energy implantation is used, then dopant distribution control is improved, but implantation depth is reduced
Solution Approach 1:
The patent applies continuity of useful action by performing repeated, low-energy implantation cycles during the continuous growth process. Instead of a single high-energy implantation, the dopant is introduced multiple times at lower energies as the layer grows, accumulating the desired total dopant concentration and depth profile. This continuous, incremental approach achieves both precise distribution control and adequate implantation depth.
Solution Approach 2:
The patent uses periodic action by implementing intermittent implantation pulses during the growth process. Low-energy implantation is performed in periodic cycles at specific growth stages, allowing precise control of dopant distribution while achieving cumulative depth penetration through multiple passes, thus resolving the contradiction between distribution precision and implantation depth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures the III-nitride body remains stable during growth and annealing, preventing decomposition and allowing for precise control of dopant concentration and distribution, enhancing the fabrication of semiconductor devices.
Implementation Method 1
The reactor chamber is equipped with an implanter for implanting any desired species. For example, Si can be used if an N-type III-nitride body is desired and Mg can be used if a P-type III-nitride body is desired. Thus, according to the present invention, as the III-nitride body is being grown in the reactor chamber it is implanted with the implanter to obtain a doped III-nitride body.
Implementation Method 2
According to one aspect of the present invention one or more stages of differential pumping can be used to obtain the gas pressure that is necessary for implanting and growth. This technique essentially relies on the finite conductance of gas molecules in a low pressure environment.
Implementation Method 3
In a process according to the present invention, the surface of the growing body is at equilibrium with its surrounding. As a result, the surface does not decompose, while it is annealed.
Data Source
AI summary
A method that includes implantation of dopants while a III-nitride body is being grown on a substrate, and an apparatus for the practice of the method.

