III-V MEMS Optoelectronic Chip for Integrated Beam Scanning

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Solution Overview

Problem

Existing optoelectronic devices for optical transduction and mechanical deflection of light beams require separate components for transduction and scanning, leading to complex and costly assembly processes, particularly in harsh environments like vehicles.

Innovation Solution

Integration of both transduction and deflection functions on a single electronic chip using III-V materials heterogeneously integrated onto a silicon platform, allowing for precise alignment and production of MEMS devices for optical beam deflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate devices are used for transduction and scanning functions, then each device can be optimized independently, but the assembly process becomes complex and costly, especially in harsh environments

Engineering Contradiction:

Improveassembly robustnessVSAvoidassembly process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the optical transducer and the optical scanning MEMS into a single integrated device fabricated on one substrate. This merging eliminates the need for separate assembly of transduction and scanning components, thereby simplifying the assembly process and improving reliability in harsh environments such as vehicles where thermal and vibrational constraints are present.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If separate devices are assembled for transduction and scanning, then manufacturing flexibility is maintained, but manufacturing time and costs increase due to post-manufacturing assembly

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidmanufacturing time

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

By integrating both transduction and scanning functions on a single substrate, the patent enables simultaneous fabrication of both components during the same manufacturing process. This eliminates post-manufacturing assembly steps, reducing manufacturing time and costs while maintaining design flexibility through the integrated architecture.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent performs preliminary integration of the optical transducer and MEMS structures during the substrate fabrication process itself, rather than assembling them after individual manufacturing. This preliminary action embeds the alignment and positioning requirements into the fabrication process, thereby eliminating subsequent assembly operations.

Inventive Principle:

Principle #10Preliminary action

3Measurement precision

If interferential optical systems are used for beam deflection, then wavelength-specific direction control is achieved, but the system lacks homogeneous scanning capability and has speed constraints

Engineering Contradiction:

Improvebeam direction controlVSAvoidscanning homogeneity

Core Design Contradiction:

Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent replaces interferential optical systems with a mechanical MEMS mirror system for beam deflection. The MEMS mirror can be mechanically tilted to achieve homogeneous scanning across a field of view, independent of wavelength, thereby providing versatile scanning capability while maintaining precise beam direction control through electrostatic actuation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach eliminates the need for separate assembly of transduction and scanning components, reducing manufacturing time and costs, while enhancing precision and reliability, and allowing for the production of compact, high-performance optoelectronic components.

Implementation Method 1

an optical transducer (10) made of a semi-conductor material III-V

Methodology Applied

Scientific EffectLight emission from semiconductor: Light Emitting Diode

Implementation Method 2

an optical scanning microelectromechanical system comprising a mirror

Methodology Applied

Scientific EffectOptical reflection: Reflection

Data Source

PatentUS12219878B2Optoelectronic component comprising, on a single substrate, an optical transducer made of a semi-conductor material III-V and an optically scanning microelectromechanical system

Publication Date: 2025.02.04 THALES SA

AI summary

An optoelectronic component includes an optical transducer made of III-V semiconductor material and an optical scanning microelectromechanical system comprising a mirror. The optical transducer and the optical scanning microelectromechanical system are produced on a common wafer comprising at least a first layer made of silicon or silicon nitride with a thickness of less than one micron and wherein at least the mirror and its holding springs are produced. In a first variant, the mobile parts of the optical scanning microelectromechanical system are produced in various layers of silicon. In a second variant, the mobile parts of the optical scanning microelectromechanical system are produced in the layer of III-V semiconductor material.