Halogen Acid and Mercapto Compound Cleaning Solution for III-V Oxide Removal

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Solution Overview

Problem

In semiconductor production, there is a challenge in precisely removing oxide films of Group III-V elements without corroding the underlying materials, especially as feature sizes decrease, and in preventing oxidation of the surface post-etching or film removal, which affects electrical properties.

Innovation Solution

A liquid composition containing 0.05-20 wt.% of a halogen acid and 0.01-10 wt.% of a mercapto compound, specifically designed to dissolve and prevent the oxidation of Group III-V element oxides, is used for treating semiconductor substrates to remove oxides and prevent metal elution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional cleaning solutions are used to remove oxide films of Group III-V elements, then oxide removal is achieved, but corrosion of underlying materials occurs

Engineering Contradiction:
Improveoxide removal precisionVSAvoidmaterial corrosion
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the chemical composition parameters of the cleaning solution by incorporating specific concentrations of halogen acid (0.05-20 wt.%) and mercapto compound (0.01-10 wt.%), which changes the selective etching characteristics to remove oxides while preserving underlying materials

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite cleaning solution containing multiple components including halogen acid, mercapto compound, and other additives that work synergistically to achieve selective oxide removal without corroding the underlying semiconductor materials

Inventive Principle:
Principle #40Composite materials

2Ease of operation

If the surface is exposed during semiconductor production, then processing is enabled, but oxidation of the surface occurs

Engineering Contradiction:
Improveprocessing accessibilityVSAvoidsurface oxidation
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The cleaning solution is applied immediately after etching or film removal while the surface is still exposed, performing oxide removal and oxidation prevention in sequence before oxidation can significantly affect the underlying materials

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The mercapto compound acts as an intermediary that forms a protective layer on the exposed surface, preventing direct oxidation while allowing the halogen acid to remove existing oxide films

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively removes Group III-V element oxides with high selectivity and prevents subsequent oxidation, maintaining a clean surface and improving the quality of semiconductor substrates by controlling the acid and mercapto compound ratio for optimal performance and recyclability.

Implementation Method 1

A liquid composition containing 0.05-20 wt.% of a halogen acid and 0.01-10 wt.% of a mercapto compound, specifically designed to dissolve and prevent the oxidation of Group III-V element oxides

Methodology Applied
Scientific EffectChemical dissolution: Chemical Bonding

Implementation Method 2

0.01-10 wt.% of a mercapto compound... prevents subsequent oxidation, maintaining a clean surface and improving the quality of semiconductor substrates by controlling the acid and mercapto compound ratio

Methodology Applied
Scientific EffectAdsorption: Adsorption

Data Source

PatentEP3258485B1Solution and method for removal of group iii-v element oxide, solution for treatment of group iii-v element compound, solution for preventing oxidation of group iii-v element, solution for treatment of semiconductor substrate, and method for production of semiconductor substrate product
Publication Date: 2021.11.24 FUJIFILM CORP
  • EP3258485B1 patent drawing
  • EP3258485B1 patent drawing
  • EP3258485B1 patent drawing

AI summary

Provided are a removal liquid for removing an oxide of a Group III-V element, an oxidation prevention liquid for preventing the oxidation of an oxide of a Group III-V element or a treatment liquid for treating an oxide of a Group III-V element, each liquid including an acid and a mercapto compound; and a method using each of the same liquids. Further provided are a treatment liquid for treating a semiconductor substrate, including an acid and a mercapto compound, and a method for producing a semiconductor substrate product using the same.