Rigid iLED Micro-Modules With Light Conductors for Secure Banknotes
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Solution Overview
Problem
Current banknotes lack electronically controlled, visible anti-counterfeiting features that can be verified without specialized equipment, and are vulnerable to environmental and mechanical stress.
Innovation Solution
A light-emitting module structure comprising a rigid micro-module with an inorganic light-emitting diode (iLED), a power source, and a control circuit, integrated with a flexible support substrate and a light conductor, which allows for visible verification of anti-counterfeiting features without external readers and is robust against mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronically controlled visible indicia are added to banknotes for anti-counterfeiting, then security verification capability is improved, but device complexity increases
Solution Approach 1:
The anti-counterfeiting system is divided into discrete micro-modules, each containing an inorganic LED, power source, and control circuit. These modular units can be independently manufactured and integrated into the banknote, allowing for simplified production and maintenance while providing distributed security features across the document.
Solution Approach 2:
The micro-module is designed to perform multiple functions: the inorganic LED provides visible light emission for verification, the piezoelectric power source enables wireless operation, and the control circuit manages operation modes. This multi-functionality within a compact unit reduces overall system complexity while enhancing security capabilities.
2Strength
If a rigid micro-module is integrated into a flexible banknote, then mechanical stress resistance is improved, but flexibility is reduced
Solution Approach 1:
The rigid micro-module is positioned at specific locations on the flexible banknote where mechanical stress is minimized. The module substrate provides localized rigidity to protect sensitive electronic components, while the overall banknote maintains its flexibility in areas where the micro-modules are not present, achieving a balance between strength and adaptability.
Solution Approach 2:
The micro-module is nested within a protective encapsulation structure that allows it to withstand mechanical stress while maintaining a compact profile. The module substrate is integrated into the banknote layers, with the rigid components protected by flexible encapsulation materials, enabling the rigid-f flexible hybrid structure to function harmoniously.
3Reliability
If inorganic LEDs are used instead of organic LEDs, then operational stability under environmental stress is improved, but manufacturing complexity increases
Solution Approach 1:
The inorganic LEDs are pre-mounted and tested on the module substrate before final integration into the banknote. This preliminary assembly allows for quality control and stress testing to be performed on the LED components in a controlled manufacturing environment, ensuring their operational stability while simplifying the final integration process into the flexible banknote structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides robust, visible anti-counterfeiting features on banknotes that can withstand environmental and mechanical stress, enabling secure verification without specialized equipment.
Implementation Method 1
The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit is powered by the power source to control the inorganic light-emitting diode to emit light
Implementation Method 2
The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit is powered by the power source
Data Source
AI summary
A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.