Illumination Device Thermal Management via Integrated Envelope
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Solution Overview
Problem
Existing illumination devices require a high number of components for heat evacuation, making their assembly complex and inefficient.
Innovation Solution
An illumination device design featuring a light source in thermal contact with a carrier, enclosed by two enveloping parts that form a single envelope, which acts as a heat sink for efficient heat dissipation, using ceramic materials for improved thermal conductivity and reduced component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple separate components (encapsulating housing, light source, circuit board, air-vents, heat sinking components) are used for heat evacuation, then heat dissipation is achieved, but device complexity increases and assembly becomes complex
Solution Approach 1:
The patent combines multiple separate heat evacuation components (encapsulating housing, air-vents, and heat sinking components) into a single integrated encapsulating housing. This housing simultaneously provides structural enclosure, heat dissipation pathways through integrated fins, and thermal management functionality, thereby reducing the total number of components while maintaining effective heat evacuation from the LED light source
Solution Approach 2:
The encapsulating housing is designed to perform multiple functions simultaneously: it serves as the structural enclosure for the light source and circuit board, provides heat sinking functionality through integrated fins, and facilitates heat evacuation through built-in air vents. This multi-functional design eliminates the need for separate dedicated heat evacuation components, simplifying the overall device structure
2Temperature
If multiple separate components are used for heat evacuation, then heat dissipation is achieved, but ease of manufacture decreases
Solution Approach 1:
The patent combines multiple separate heat evacuation components (encapsulating housing, air-vents, and heat sinking components) into a single integrated encapsulating housing. This housing simultaneously provides structural enclosure, heat dissipation pathways through integrated fins, and thermal management functionality, thereby reducing the total number of components while maintaining effective heat evacuation from the LED light source
Solution Approach 2:
The encapsulating housing is divided into two separate enveloping parts that can be manufactured independently and then joined together to form the complete housing. This segmentation allows each part to be optimized for manufacturing and assembly, while the integrated heat dissipation features remain functional when the parts are combined
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates convenient assembly and effective heat transfer, reducing the complexity and number of components while maintaining efficient light transmission and thermal management.
Implementation Method 1
The carrier is arranged in thermal contact with at least one of the enveloping parts for dissipating heat out of the illumination device
Implementation Method 2
the envelope comprises at least two enveloping parts which, when joined together, form the envelope. The carrier is arranged in thermal contact with at least one of the enveloping parts for dissipating heat out of the illumination device
Data Source
AI summary
The present invention discloses an illumination device (100). The illumination device (100) comprises a light source (110) arranged to generate light, a carrier (120) arranged to support the light source and an envelope (130) enclosing the light source and the carrier. The envelope comprises at least two enveloping parts which, when joined together, form the envelope. Further, the carrier is arranged in thermal contact with at least one of the enveloping parts for dissipating heat out of the illumination device.