Compact Illumination Module for Near-Eye Depth Sensing
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Solution Overview
Problem
Conventional light sources for depth sensing technology are bulky and costly, making them unsuitable for wearable or mobile applications, and their manufacturing processes cannot be easily integrated with automated assembly methods used in electronic component production.
Innovation Solution
An illumination module comprising a semiconductor-based light source mounted on a circuit board with an encasing and optical surfaces that condition and redirect light, allowing for automated manufacturing and compact design suitable for near-to-eye display systems and depth sensing applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional light sources are used for depth sensing, then sufficient illumination is achieved, but the device becomes bulky and unsuitable for wearable applications
Solution Approach 1:
The patent combines multiple optical functions (light emission, collimation, beam shaping, and directional control) into a single integrated illumination module. The semiconductor light source, collimator lens, and optical elements are mounted together on a circuit board within a unified housing, creating a compact assembly that maintains sufficient illumination intensity while dramatically reducing the overall volume compared to conventional separate components
Solution Approach 2:
The patent transitions from traditional bulky three-dimensional optical assemblies to a planar configuration where optical elements are mounted on a circuit board in a two-dimensional arrangement. This dimensional reorganization allows the illumination module to achieve compact form factor suitable for wearable devices while preserving optical performance through careful layout optimization
2Manufacturing precision
If conventional light sources with manual assembly are used, then optical alignment is achieved, but manufacturing cost increases and automation is difficult
Solution Approach 1:
The patent incorporates optical elements directly into the circuit board assembly process, where collimator lenses and other optical components are mounted in predetermined locations during automated PCB manufacturing. This preliminary positioning eliminates the need for subsequent manual optical alignment, maintaining manufacturing precision while enabling automated production and reducing costs
Solution Approach 2:
The circuit board serves multiple functions: it provides electrical connections for the semiconductor light source, mechanical support for mounting optical elements, and a reference plane for optical alignment. This multi-functional design consolidates several components into one, simplifying the manufacturing process and enabling automated assembly while maintaining precise optical relationships
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of compact, cost-effective illumination modules for depth sensing systems, suitable for use in wearable devices like head-mounted displays, by using automated manufacturing processes and optimizing light distribution for efficient depth sensing.
Implementation Method 1
The semiconductor-based light source can emit light in a first illumination pattern
Implementation Method 2
The one or more optical surfaces can be collectively configured to receive, redirect, and/or collimate the light
Implementation Method 3
The one or more optical surfaces can be collectively configured to receive, redirect, and/or collimate the light
Implementation Method 4
The one or more optical surfaces can further be collectively configured to condition and redirect the light, and to output the conditioned and redirected light
Data Source
AI summary
An illumination module can comprise a circuit board, a semiconductor-based light source mounted to the circuit board, an encasing mounted to the circuit board, and one or more optical surfaces at least partially contained within the encasing. The semiconductor-based light source can emit light in a first illumination pattern. The one or more optical surfaces can be collectively configured to receive the light from the edge-emitting semiconductor-based light source. The one or more optical surfaces can further be collectively configured to condition and redirect the light, and to output the conditioned and redirected light from the illumination module in a second illumination pattern different from the first illumination pattern.