Illumination Projector Module Vertical Alignment Features
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitter and detector modules face challenges in maintaining precise spatial and optical tolerances due to adhesive use and manufacturing variations, especially when operating over a wide temperature range, leading to poor performance and heat conduction issues.
Innovation Solution
The solution involves a light emitter module with vertical alignment features that can be machined to establish precise distances between the optoelectronic device and optical elements, using UV-curable adhesives and materials with low thermal expansion to ensure stability and thermal management, along with customizable spacers and optical assemblies for improved focusing and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If adhesive is used to assemble the light emitter module, then assembly is simplified and manufacturing efficiency is improved, but spatial and optical tolerances deteriorate to unacceptable levels
Solution Approach 1:
The module is divided into separate functional components (light emitter, optical elements, support structures) that can be manufactured with high precision independently, then assembled using adhesive. This segmentation allows each component to be optimized for its specific function while maintaining overall assembly efficiency.
Solution Approach 2:
Vertical alignment features are incorporated into the design before assembly to pre-establish precise spatial relationships between components. These features guide the adhesive bonding process and ensure that optical elements are positioned at optimal distances from the light emitter, maintaining tight tolerances despite the use of adhesive.
2Device complexity
If conventional manufacturing tolerances are used for support structures, then manufacturing cost and complexity are reduced, but module performance deteriorates due to expanded tolerances
Solution Approach 1:
Different regions of the support structure are designed with different precision requirements. Critical areas (such as mounting surfaces for optical elements and alignment features) are manufactured with tight tolerances to ensure proper positioning, while non-critical areas use conventional tolerances to reduce manufacturing complexity and cost.
Solution Approach 2:
The design incorporates specific geometric parameters (such as vertical alignment features and optimized support structure dimensions) that compensate for manufacturing variations. By carefully selecting and controlling key parameters, the module maintains reliable performance even when conventional manufacturing tolerances are applied to non-critical components.
3Adaptability or versatility
If the module operates over a large temperature range, then environmental adaptability is improved, but spatial dimensions and refractive index vary causing poor optical performance
Solution Approach 1:
The support structure is designed to account for thermal expansion and contraction of components over the operating temperature range. By incorporating expansion compensation features and selecting materials with compatible thermal properties, the module maintains stable spatial dimensions and optical performance from -20°C to 70°C.
Solution Approach 2:
The module uses composite material structures (such as metal-ceramic or metal-polymer combinations) that provide both mechanical support and thermal management. These composite structures are designed to minimize differential thermal expansion between components, maintaining precise optical alignment across the full temperature range while enabling operation in diverse environmental conditions.
4Loss of energy
If materials with high thermal conductivity are used for heat conduction, then thermal management is improved, but manufacturing precision deteriorates due to material processing difficulties
Solution Approach 1:
The thermal management system is segmented into dedicated heat dissipation components (such as separate heat sinks or thermal vias) that are integrated with the support structure. This allows high thermal conductivity materials to be used specifically in thermal pathways without requiring the entire assembly to be manufactured from difficult-to-process materials, maintaining dimensional precision while achieving excellent heat conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides ultra-precise and stable packaging for light emitter modules, maintaining optimal performance across a wide temperature range and preventing light leakage, while enabling precise alignment and thermal management, thus enhancing the overall efficiency and reliability of light projection applications.
Implementation Method 1
using UV-curable adhesives
Implementation Method 2
The sub-mount assembly includes a metal trace on a sub-mount... enabling precise alignment and thermal management
Implementation Method 3
vertical alignment features that are in direct contact with the optical element... The first spacer also is fixed to a second spacer that forms part of the first assembly
Data Source
Figure 1A~1B
Figure 1C
Figure 2
AI summary
This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.