Hermetic Illumination Device Manufacturing via Through-Hole Sealing
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Solution Overview
Problem
Existing illumination devices face challenges in protecting luminescent materials from environmental exposure to oxygen and water, which can lead to deterioration, limiting their application in harsh environments.
Innovation Solution
A method for manufacturing illumination devices involves sealing a substrate with a light source and a partially light-transmitting cover to create an enclosed space, where the luminescent material is introduced through a through-hole and sealed, allowing for the use of sensitive materials and enabling operation in harsh conditions by filling non-filled regions with an inert gas or negative pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the luminescent material is applied prior to the cover being coupled to the substrate, then the manufacturing process is simpler, but the luminescent material is exposed to environmental conditions causing deterioration
Solution Approach 1:
The manufacturing process is divided into distinct stages: first sealing the cover to the substrate to create an enclosed space, then introducing the luminescent material through a through-hole, and finally sealing the through-hole. This segmentation allows the luminescent material to be protected from environmental exposure while maintaining a manageable manufacturing process.
Solution Approach 2:
The cover is sealed to the substrate before the luminescent material is applied, creating a protected enclosed space in advance. This preliminary action establishes a controlled environment that prevents environmental deterioration of the luminescent material before it is even introduced into the system.
2Reliability
If the cover is sealed to the substrate before introducing the luminescent material, then the luminescent material is protected from environmental exposure, but the handling of the cover during production becomes more difficult
Solution Approach 1:
The introduction of the luminescent material is achieved through a separate through-hole structure, dividing the cover into functional regions: a sealed portion for protection and an open through-hole for material introduction. This segmentation maintains ease of handling during production while ensuring protection.
Solution Approach 2:
The through-hole acts as an intermediary element that allows the luminescent material to be introduced into the enclosed space without compromising the seal between the cover and substrate. This intermediary structure facilitates both protection and material introduction.
3Reliability
If a hermetic seal is formed by anodic bonding of glass wafer onto silicon wafer, then the luminescent material is enclosed and protected, but the process requires high temperature that may damage temperature-sensitive luminescent materials
Solution Approach 1:
The cover is sealed to the substrate before the luminescent material is introduced. This preliminary sealing action creates a protected enclosed space that can use high-temperature bonding methods without exposing the temperature-sensitive luminescent material to damaging temperatures.
Solution Approach 2:
The manufacturing process is segmented into temperature-independent stages (sealing, material introduction) and temperature-sensitive stages (material application). This allows the use of high-temperature anodic bonding for the seal while protecting the luminescent material from thermal damage.
4Use of energy by moving object
If the enclosed space is completely filled with luminescent material, then the light conversion efficiency is maximized, but the introduction and distribution of the material becomes more difficult
Solution Approach 1:
The enclosed space is filled with luminescent material to the appropriate level, potentially exceeding the minimum required to ensure complete coverage of the light source. This partial/excessive filling approach maximizes light conversion efficiency while the through-hole introduction method keeps the manufacturing process manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively protects luminescent materials from environmental damage, enabling the use of sensitive materials and allowing illumination devices to operate in harsh environments, such as underwater or in greenhouses, while facilitating handling and reducing the risk of damaging temperature-sensitive materials.
Implementation Method 1
any non-filled regions of the enclosed space are filled up with an inert gas or are provided with a negative pressure
Implementation Method 2
the through-hole is then sealed so as to seal the enclosed space
Implementation Method 3
an at least partially light transmitting cover is sealingly coupled to the substrate such that an enclosed space is defined by at least the first side of the substrate and the cover
Data Source
Figure 1
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Figure 5~7
AI summary
An illumination device is manufactured by providing (101) a substrate (1) having a first side (la), sealingly coupling (106) an at least partially light transmitting cover (2) to the substrate (1) such that an enclosed space (3) is defined by at least the first side (la) of the substrate (1) and the cover (2), providing a through-hole (4) into the enclosed space (3), and introducing (107) a luminescent material into the enclosed space (3) via the through-hole (4). By hermetically sealing (108) the through-hole (4) after the introduction of the luminescent material, the enclosed space (3) becomes sealed and hence luminescent materials being relatively sensitive to e.g. water and/or oxygen become protected from exposure to the environment.