Image-Capture Apparatus Heat-Releasing Air Duct Design

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional image-capture apparatuses face issues with heat radiation efficiency, leading to user discomfort due to heat transfer during use and potential dust ingress through ventilation holes, while also requiring larger sizes or reduced heat conduction measures.

Innovation Solution

An image-capture apparatus with a heat-releasing air duct on its outer surface that does not communicate with the inner casing, utilizing a duct forming part to direct heat away from the user's grip area and incorporating a partition to isolate heat-sensitive components, thereby improving heat radiation efficiency without increasing size or compromising durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If heat generating elements are isolated by providing a partition plate inside the outer casing and heat is conducted to the outer casing to be released outside, then heat radiation efficiency is improved, but the heat is transferred to the user's hand making the user uncomfortable

Engineering Contradiction:
Improveheat radiation efficiencyVSAvoidheat transfer to user
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The outer casing is segmented into a grip portion and a non-grip portion, with the heat-releasing air duct specifically formed on the non-grip portion. This segmentation allows heat to be released from a location that does not contact the user's hand, resolving the contradiction between effective heat radiation and user comfort.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat-releasing function is extracted from the general outer casing surface and concentrated into a specific air duct structure on the non-grip portion. This extraction allows targeted heat release away from the user contact area while maintaining overall heat radiation efficiency.

Inventive Principle:
Principle #2Taking out (Extraction)

2Loss of energy

If intake hole and exhaust hole are formed in the outer casing for cooling fan operation, then heat release is improved, but dust and the like enter the inside of the outer casing causing malfunction

Engineering Contradiction:
Improveheat release efficiencyVSAvoiddust ingress prevention
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The air duct is extracted as a separate structure from the outer casing openings. The air duct has its own independent openings that do not communicate with the inner casing, allowing heat release without creating direct pathways for dust ingress into the internal components.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The air duct acts as an intermediary structure between the heat generating elements and the external environment. It provides a dedicated heat release pathway that is isolated from the internal casing space, preventing direct contact between external dust and internal components while still enabling effective heat transfer.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Loss of energy

If the outer casing is increased in size to improve heat radiation efficiency, then heat radiation efficiency is improved, but the apparatus size increases

Engineering Contradiction:
Improveheat radiation efficiencyVSAvoidapparatus size
Core Design Contradiction:
Loss of energyVSVolume of moving object

Solution Approach 1:

Instead of increasing the overall casing size, the air duct is formed with specific local geometry on the non-grip portion. The duct's cross-sectional area and surface area are optimized locally to maximize heat radiation efficiency without affecting the overall compact dimensions of the apparatus.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The air duct utilizes the third dimension (depth/protrusion from casing surface) to increase heat radiation surface area. By forming the duct as a protruding structure on the outer surface, the heat radiation area is expanded without increasing the planar footprint or overall volume of the apparatus.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively enhances heat radiation efficiency while maintaining a compact design, reducing thermal impact on user-handled areas and preventing dust ingress, thus improving usability and reliability.

Implementation Method 1

heat generated by the electronic components mounted on the circuit board is conducted to the duct forming part to be released outside of the outer casing from the heat-releasing air duct

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the heat generated by the electronic components, which will be heat generating elements, is released outside of the outer casing from the heat-releasing air duct

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS7706684B2Image-capture apparatus
Publication Date: 2010.04.27 SONY GROUP CORP
  • US7706684B2 patent drawing
  • US7706684B2 patent drawing
  • US7706684B2 patent drawing

AI summary

An image-capture apparatus includes: an outer casing inside of which predetermined sections are arranged; an imaging device arranged inside of the outer casing; and a circuit board arranged inside of the outer casing, on which electronic components are mounted, the electronic components being heat generating elements. A heat-releasing air duct is formed on an outer surface side of the outer casing, at least an opening of the duct being formed at one surface of the outer casing and not communicating with an inside of the outer casing. Part of the outer casing is provided as a duct forming part that forms the heat-releasing air duct. Heat generated by the electronic components mounted on the circuit board is conducted to the duct forming part to be released outside of the outer casing from the heat-releasing air duct.