Image Capture Device Mounted on Flexible Circuit Substrate
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Solution Overview
Problem
Existing digital camera modules face challenges in optical alignment and increased complexity due to multiple components and electrical connections, leading to higher costs and reduced reliability, especially in small devices like mobile phones.
Innovation Solution
A digital camera module with an image capture device mounted directly on a flexible printed circuit (FPC) substrate, reducing optical alignment tolerances and electrical connections, and using a stiffener for support, along with conductive trace layers and contact pads for efficient assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple devices are mounted on a rigid PCB, then the device can accommodate various components (image capture device, keypad, etc.), but the alignment precision of the image capture device with the lens opening deteriorates due to accumulated tolerances
Solution Approach 1:
The patent divides the camera module into two separate parts: an independent camera module containing the image capture device and lens, and a main PCB containing other components like the keypad. This segmentation allows each part to be optimized independently for its specific function, with the camera module achieving precise optical alignment without being constrained by the tolerance accumulations of a multi-component rigid PCB assembly.
2Manufacturing precision
If an independent camera module with FPC is used to improve alignment, then optical alignment precision is improved, but the device complexity increases due to additional components and assembly steps
Solution Approach 1:
The patent combines the image capture device die directly with the FPC substrate by mounting the die onto the FPC, eliminating the need for a separate CLCC package. This merging of components reduces the total number of parts while maintaining precise optical alignment, as the FPC provides both mechanical support and electrical connectivity in a single integrated structure.
3Ease of operation
If multiple electrical connections are made through CLCC and FPC, then the image capture device can be electrically connected to the main PCB, but the reliability deteriorates due to increased points of failure
Solution Approach 1:
The patent extracts and eliminates the CLCC (ceramic leadless chip carrier) from the assembly by mounting the image capture device die directly onto the FPC substrate. This removal of the intermediate CLCC component reduces the number of electrical connection interfaces from multiple stages (die-to-CLCC, CLCC-to-PCB) to a single direct connection (die-to-FPC), thereby reducing points of failure and improving overall system reliability.
4Stability of the object's composition
If a stiffener is added to support wire bonding and component mounting, then the structural stability is improved, but the device complexity increases
Solution Approach 1:
The stiffener serves multiple functions simultaneously: it provides structural support for wire bonding operations, supports the mounting of the image capture device die, and maintains the mechanical stability of the FPC substrate during assembly. By designing this single component to fulfill multiple roles, the patent achieves improved structural stability without proportionally increasing device complexity.
Data Source
AI summary
A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).