Image Capture Heatsink With Graphite Sheet Heat Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As more components and processing power are added to image capture devices, they generate increased thermal loads that can impact operation and potentially damage components, necessitating improved thermal management.
Innovation Solution
The implementation of a heatsink with a planar surface and a sheet conductor made of a material with higher thermal conductivity than the heatsink material, which is connected to a printed circuit board and located partially or completely within the device's housing, along with features like cutouts and mounting flanges to support components and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more components and processing power are added to image capture devices, then functionality and image quality are improved, but thermal load increases causing operation issues and potential component damage
Solution Approach 1:
A sheet conductor made of graphite or graphite foam is introduced as an intermediary thermal management component between the printed circuit board and the heatsink. This sheet conductor enhances heat transfer from the PCB to the heatsink, effectively managing thermal load while allowing continued use of high-performance components that generate more heat
Solution Approach 2:
The thermal management system uses composite material construction, combining a metal heatsink (aluminum or copper) with a graphite or graphite foam sheet conductor. The graphite material provides superior thermal conductivity in the plane of the sheet, creating a composite thermal management solution that handles increased thermal loads from advanced components
2Temperature
If a heatsink is added to manage thermal load, then temperature control is improved, but device complexity increases
Solution Approach 1:
The sheet conductor is integrated directly with the heatsink structure, merging the thermal conduction function into the existing thermal management component rather than adding separate discrete elements. This reduces overall structural complexity while maintaining effective thermal management
Solution Approach 2:
The heatsink structure serves multiple functions: it provides thermal management for the PCB, supports the sheet conductor for enhanced heat transfer, and maintains structural integrity within the device housing. This multi-functionality reduces the need for additional separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management, allowing for extended use of the image capture device by effectively dissipating heat and preventing component damage.
Implementation Method 1
The sheet conductor is made of a material that has a higher thermal conductivity than the material of the heatsink
Data Source
AI summary
An image capture device having a housing and a heatsink. The image capture device includes an integrated sensor and lens assembly. The heatsink is located partially or completely within the housing. The heatsink includes a through which a portion of the integrated sensor and lens assembly extends, and a planar surface located adjacent to the cutout. The planar surface includes a front side and a rear side. A printed circuit board in communication with a rear side of the planar surface of the heatsink. An LCD recess located in a front side of the planar surface of the heatsink that is configured to receive a liquid crystal display, wherein the LCD recess is opposite the printed circuit board.