Image-Capturing Assembly Thickness Reduction via Holder Integration
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Solution Overview
Problem
Portable devices face a challenge in achieving a balance between large panel specifications for high resolution and image capturing capabilities while maintaining a thin and light form factor, leading to insufficient internal space.
Innovation Solution
The image-capturing assembly reconfigures elements such as the circuit board, optical filter, and holder to reduce the overall thickness by adjusting the arrangement positions and fixing manners of these components, minimizing the distance between the optical filter and the image-capturing element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the panel size and resolution are increased to improve image quality, then the imaging capability is improved, but the device weight and thickness increase
Solution Approach 1:
The patent combines the optical filter and holder into an integrated structure, where the holder serves dual functions of supporting the optical filter and providing structural support for the entire imaging assembly. This merging eliminates the need for separate mounting components and reduces overall assembly thickness and weight while maintaining high-resolution imaging capability.
Solution Approach 2:
The imaging elements are arranged in a nested configuration where the optical filter is positioned within the holder structure, and the entire optical assembly is integrated into the circuit board layout. This nesting approach maximizes space utilization and minimizes the overall footprint and thickness of the imaging module.
2Weight of moving object
If the device is made thinner and lighter to improve portability, then the portability is improved, but the internal space becomes insufficient
Solution Approach 1:
The patent transitions from a traditional layered arrangement to a more compact three-dimensional integration where components are positioned in multiple layers and orientations. The optical filter and image-capturing element are arranged in a vertically stacked configuration with optimized spacing, effectively utilizing the Z-dimension to reduce overall thickness while accommodating all necessary components within a compact volume.
Solution Approach 2:
The holder is designed as a thin-walled structure that provides sufficient mechanical support while minimizing material usage. The optimized wall thickness and strategic rib reinforcement maintain structural integrity while reducing the holder's volume and weight, thereby preserving internal space for other components.
3Length of stationary object
If the optical filter and image-capturing element are positioned closer to reduce thickness, then the assembly thickness is reduced, but the alignment precision becomes more difficult to maintain
Solution Approach 1:
The holder serves as an intermediary structure that precisely positions both the optical filter and image-capturing element. The holder incorporates integrated positioning features such as recesses, protrusions, or alignment pins that ensure accurate relative positioning of the optical components while maintaining a compact thickness. This mediator structure absorbs the alignment tolerance requirements, simplifying the manufacturing process.
Solution Approach 2:
The positioning and support functions are merged into the holder structure itself, which is integrally formed with positioning features. This combined structure eliminates the need for separate alignment mechanisms and reduces the number of assembly steps, thereby maintaining manufacturing precision while reducing overall assembly complexity and thickness.
Data Source
AI summary
An image-capturing assembly includes a circuit board, an optical filter, an image-capturing element between the circuit board and the optical filter, and a holder. The holder includes a fixing portion. The image-capturing element is on the circuit board and electrically connected to the circuit board. The holder is on an external side of the image-capturing element. The fixing portion has an upper surface and a lower surface opposite to each other, and the lower surface is fixed on the circuit board. The optical filter is fixed on the upper surface of the fixing portion.