Image Capturing Assembly Integrating Photosensitive Chip and Functional Components
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Solution Overview
Problem
Conventional lens modules face challenges in miniaturization and ultra-thin thickness due to the separation of photosensitive chips and functional components, leading to increased size and reduced signal transmission rates, which affects image capturing and storage speed.
Innovation Solution
Integrating photosensitive chips and functional components into an encapsulation layer, reducing the distance between them and eliminating the need for circuit boards, thereby enhancing signal transmission and operational performance while meeting miniaturization and ultra-thin thickness requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photosensitive chips and functional components are separated and mounted on circuit boards, then ease of manufacture is improved, but device size increases and signal transmission speed decreases
Solution Approach 1:
The patent merges photosensitive chips and functional components into a single integrated image capturing assembly. The photosensitive chip is directly mounted on a substrate without traditional circuit boards, and functional components are integrated onto the same substrate, reducing overall device volume while maintaining manufacturability through direct bonding techniques.
Solution Approach 2:
The patent transitions from a planar circuit board layout to a three-dimensional integrated structure where photosensitive chips and functional components are stacked and bonded in multiple layers. This vertical integration reduces the horizontal footprint and overall device size while preserving manufacturing capabilities through advanced bonding processes.
2Ease of manufacture
If photosensitive chips and functional components are separated and mounted on circuit boards, then ease of manufacture is improved, but signal transmission speed decreases
Solution Approach 1:
The patent combines photosensitive chips and functional components into a tightly integrated assembly where signal paths are minimized. Direct bonding techniques eliminate long trace connections on circuit boards, reducing signal transmission distance and improving speed while maintaining manufacturing feasibility through specialized bonding processes.
3Speed
If photosensitive chips and functional components are integrated into encapsulation layer, then signal transmission speed improves and device size reduces, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary bonding of photosensitive chips to substrates before final assembly, and pre-integrates functional components onto the substrate. This staged approach simplifies the overall manufacturing process by breaking down complex integration into manageable steps, reducing manufacturing complexity while achieving high signal transmission speeds through close integration.
4Speed
If distance between photosensitive chip and functional components is reduced, then signal transmission speed improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary alignment and bonding processes where photosensitive chips are precisely positioned and bonded to substrates before final assembly. Pre-registration marks and alignment features are incorporated into the substrate design, enabling high-precision positioning that reduces the distance between components while managing manufacturing precision requirements through staged processing.
Data Source
AI summary
The present disclosure provides an image capturing assembly and its packaging method, a lens module and an electronic device. The packaging method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; providing a carrier substrate and temporarily bonding the photosensitive chip and functional components on the carrier substrate; and forming an encapsulation layer on the carrier substrate and at least between the photosensitive chip and the functional components.