Image Capturing Device Spacer and Sealant Design

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Solution Overview

Problem

The existing manufacturing process for image capturing devices often results in the removal of a thin-film-transistor substrate portion falling off and scraping the underlying color filter or black matrix layer, which affects image capturing quality due to the need for a compact and thin design.

Innovation Solution

The proposed solution involves forming a black matrix layer with a via on a substrate, covering it with an anti-reflection layer, and using spacers on the black matrix layer to prevent the counter substrate from falling off during the opening formation, thereby protecting the underlying layers and maintaining image quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If a portion of the thin-film-transistor substrate is removed to form an opening for the photographic lens, then the image capturing device can be made compact and thin, but the removed portion may fall off and scrape the underlying color filter or black matrix layer, affecting image capturing quality

Engineering Contradiction:
Improvethickness of image capturing deviceVSAvoidimage capturing quality
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The patent applies preliminary anti-action by forming a protective layer (sealant) over the black matrix layer and color filter before removing the counter substrate to create the opening. This protective layer prevents the removed counter substrate portion from scraping and damaging the underlying layers during the opening formation process, thus maintaining image capturing quality while enabling the compact thin design

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The patent implements beforehand cushioning by introducing a sealant layer that covers the black matrix layer and extends beyond its edges. This sealant acts as a cushioning protective layer that absorbs any potential damage from the removed counter substrate portion, preventing direct contact between the falling debris and the sensitive color filter or black matrix layer underneath

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If spacers are added to protect the underlying layers during opening formation, then image capturing quality is maintained, but the device complexity increases

Engineering Contradiction:
Improveimage capturing qualityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing the sealant layer to serve multiple functions: it acts as a protective layer during opening formation, serves as an adhesive bonding layer between substrates, and provides structural support. This multi-functionality reduces the need for separate protective structures, thereby limiting the increase in device complexity while maintaining image capturing quality

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10298822B1Image capturing device and method of manufacturing the same
Publication Date: 2019.05.21 INTERFACE TECH (CHENGDU) CO LTD
  • US10298822B1 patent drawing
  • US10298822B1 patent drawing
  • US10298822B1 patent drawing

AI summary

An image capturing device includes a substrate, a black matrix layer, an anti-reflection layer, a counter substrate, a sealant, a plurality of spacers and a photo-sensitive component. The black matrix layer is disposed on the substrate. The black matrix layer has a via exposing a portion of the substrate. The anti-reflection layer covers the via of the black matrix layer. The counter substrate is disposed opposite to the substrate. The counter substrate has an opening, and a orthographic projection of the opening onto the black matrix layer is overlapped with the anti-reflection layer and a portion of the black matrix layer surrounding the via. The sealant is disposed between the counter substrate and the substrate. The spacers are disposed over the portion of the black matrix layer surrounding the via. The photo-sensitive component is disposed at the opening of the counter substrate.