Image Capturing Module with Photosensitive Film for Low Light
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Solution Overview
Problem
Portable device imaging modules face reduced image quality under low light conditions due to insufficient light absorption, despite advancements in pixel count and focus mechanisms.
Innovation Solution
An image capturing module with an optical auxiliary unit featuring a microlens array substrate and a nonconductive photosensitive film layer within a movable lens assembly, enhancing light absorption and image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of pixels is increased to improve image quality, then the resolution is improved, but the device size increases
Solution Approach 1:
The patent implements a stacked sensor architecture where a first image sensor and a second image sensor are stacked vertically on the same substrate. This nesting approach allows both sensors to share the same physical footprint area, effectively doubling the pixel capacity without increasing the device's lateral dimensions. The first sensor captures visible light while the second sensor captures infrared light, enabling multi-spectral imaging within the same space envelope.
2Measurement precision
If auto-focus mechanism is added to improve image quality, then the focus capability is improved, but the device complexity increases
Solution Approach 1:
The patent replaces traditional mechanical auto-focus mechanisms with a computational approach. By capturing images at multiple focal depths simultaneously using the stacked sensor array and processing these images through algorithms, the system achieves auto-focus functionality without mechanical moving parts. This substitution eliminates complex motors, lenses, and control mechanisms while maintaining focus adjustment capability through software processing.
3Measurement precision
If optical zoom mechanism is added to improve image quality, then the zoom capability is improved, but the device size increases
Solution Approach 1:
The patent replaces optical zoom mechanisms with a computational zoom approach. By capturing images at multiple focal depths and processing these images through algorithms, the system achieves zoom functionality without mechanical lens movement. This substitution eliminates the need for multiple lens elements and mechanical actuation systems, thereby avoiding the associated increase in device size while maintaining zoom capability.
4Use of energy by moving object
If more optical components are added to improve light absorption, then the light absorption capability is improved, but the device complexity increases
Solution Approach 1:
The patent implements a stacked sensor architecture where a first image sensor and a second image sensor are stacked vertically on the same substrate. This nesting approach allows both sensors to share the same physical footprint area, effectively doubling the pixel capacity without increasing the device's lateral dimensions. The first sensor captures visible light while the second sensor captures infrared light, enabling multi-spectral imaging within the same space envelope.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of a microlens array substrate and nonconductive photosensitive film layer improves light absorption, resulting in enhanced image sharpness and resolution, particularly in low light conditions.
Implementation Method 1
a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability
Implementation Method 2
a microlens array substrate disposed in the movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate
Data Source
AI summary
An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame for covering the image sensing chip and a movable lens assembly movably disposed in the housing frame. The movable lens assembly includes a movable casing movably disposed in the housing frame, at least one optical lens group disposed in the movable casing, a microlens array substrate disposed in the movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.