Image Capturing Module Heat Dissipation via Vertical Airflow

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Solution Overview

Problem

Conventional image capturing modules face challenges in effectively dissipating heat due to their compact design, leading to performance impacts and potential damage from heat accumulation.

Innovation Solution

An image capturing module with a casing, camera unit, circuit board device, and heat dissipation device, including a heat sink and ventilating windows, is designed to dissipate heat generated by functional modules, utilizing heat conduction fillers and a heat dissipation fan to prevent heat accumulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the image capturing module is designed to be compact and miniaturized, then the volume of the module is reduced, but the heat dissipation capability deteriorates

Engineering Contradiction:

Improvevolume of image capturing moduleVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation fan that generates airflow in a direction perpendicular to the circuit board, utilizing the third dimension (vertical airflow) rather than relying solely on horizontal heat conduction through the compact structure. This dimensional approach allows effective heat dissipation without increasing the planar footprint of the compact module.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a heat dissipation fan to create forced convection airflow through the module. By introducing pneumatic flow (air movement) through strategically positioned air inlets and outlets, the system actively transports heat away from functional modules, overcoming the heat dissipation limitations imposed by the compact volume.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Device complexity

If functional modules are integrated within a small and closed space, then the device complexity is reduced, but heat accumulation increases

Engineering Contradiction:

Improveintegration of functional modulesVSAvoidheat accumulation

Core Design Contradiction:

Device complexityVSObject-generated harmful factors

Solution Approach 1:

The patent extracts heat from the integrated functional modules by introducing a dedicated heat dissipation system. The heat dissipation fan and airflow channels separate the heat transfer function from the functional modules themselves, allowing the modules to remain integrated while heat is actively removed through external airflow paths.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces airflow as an intermediary medium between the functional modules and the external environment. The heat dissipation fan drives air through inlet channels that pass over functional modules, and outlet channels that exhaust the heated air, using this intermediary fluid to transfer heat away from the integrated components.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If the image capturing module operates for extended periods, then the productivity is improved, but heat accumulation damages the module

Engineering Contradiction:

Improveoperational durationVSAvoidmodule damage from heat

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent implements continuous heat dissipation through the heat dissipation fan that operates throughout the functional operation of the module. The airflow system maintains continuous heat removal, preventing heat accumulation that would otherwise limit operational duration or cause damage during extended use.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The patent applies preliminary cooling action by positioning the heat dissipation fan and airflow channels to prevent heat accumulation before it reaches damaging levels. The system proactively removes heat during normal operation rather than reacting to overheating conditions, thereby protecting the module during extended operational periods.

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat, ensuring the performance and reliability of the functional modules and the overall image capturing module by preventing heat accumulation and maintaining optimal operational conditions.

Implementation Method 1

a heat sink attached on a surface of the functional module for dissipating heat from the functional module

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The heat dissipation device includes a heat sink attached on a surface of the functional module for dissipating heat from the functional module

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10884320B2Image capturing module

Publication Date: 2021.01.05 SZ DJI TECH CO LTD

AI summary

An apparatus includes a camera unit including an optical lens, a circuit board unit connected to the camera unit and disposed at a periphery of the camera unit, and a casing including a first housing body and a second housing body attachable to the first housing body. The first housing body and the second housing body are configured to enclose a receiving space to receive the camera unit and the circuit board unit, and jointly define a front opening that intersects with an optical axis of the optical lens.