Image Capturing Module Coplanarity via Reinforcing Frame
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Solution Overview
Problem
Conventional dual camera systems in smartphones suffer from inferior coplanarity of image sensors, leading to suboptimal image quality due to the lack of structural reinforcement, which affects the alignment and parallelism of image sensing chips.
Innovation Solution
An image capturing module comprising a circuit substrate, a structure reinforcing frame, image sensing chips, an adhesive body, and lens modules, where the image sensing chips are coplanarly disposed on a datum plane with the adhesive body connecting them to the reinforcing frame, ensuring optimal alignment and parallelism, and the module includes additional features like heat dissipation substrates and auxiliary frames for enhanced stability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional dual camera system is used without structural reinforcement, then the device structure remains simple, but the coplanarity of image sensors deteriorates
Solution Approach 1:
The patent divides the support structure into multiple functional components: a circuit substrate for electrical connections, a reinforcing frame for structural support and coplanarity maintenance, and adhesive bodies for precise positioning. This segmentation allows each component to specialize in its function, achieving high manufacturing precision without excessive overall complexity.
Solution Approach 2:
The reinforcing frame acts as an intermediary element between the circuit substrate and the image sensing chips. It provides the necessary structural reinforcement to maintain coplanarity while being integrated into the existing device architecture, thus improving precision without proportionally increasing complexity.
2Manufacturing precision
If image sensing chips are mounted without adequate structural support, then the assembly process remains fast, but the alignment precision deteriorates
Solution Approach 1:
The circuit substrate and reinforcing frame are prepared in advance with pre-defined mounting positions and structural features. The adhesive bodies are pre-positioned on the reinforcing frame, allowing image sensing chips to be quickly attached without requiring complex real-time alignment procedures, thus maintaining both precision and productivity.
3Stability of the object's composition
If multiple image sensing chips are mounted on a flexible substrate, then the device size remains small, but the coplanarity and stability deteriorate
Solution Approach 1:
The patent applies local reinforcement only where needed - the reinforcing frame is strategically positioned behind the image sensing chips to provide coplanarity support, while the rest of the device maintains a compact form factor. This localized approach enhances stability without proportionally increasing overall volume.
4Manufacturing precision
If adhesive material is used to connect image sensing chips to the reinforcing frame, then the coplanarity is maintained, but the gap enclosure and protection requirements increase
Solution Approach 1:
The adhesive body performs multiple functions simultaneously: it bonds the image sensing chips to the reinforcing frame, maintains coplanarity through its positioning features, and encloses gaps to provide protection. This multi-functionality reduces the need for separate components, thereby maintaining precision without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains the optimum coplanarity of image sensing chips, enhancing image clarity and heat dissipation efficiency, thereby improving the overall performance of the image capturing module.
Implementation Method 1
The adhesive body is disposed on the structure reinforcing frame, and the adhesive body is connected between each image sensing chip and the structure reinforcing frame for enclosing a gap between the image sensing chip and the structure reinforcing frame
Implementation Method 2
all of the image sensing chips, the adhesive body, and the convex bodies are coplanarly disposed on the heat dissipation substrate, so that a back side of each image sensing chip, a bottom surface of the adhesive body, and a bottom surface of each convex body are flush with each other and contact the heat dissipation substrate
Implementation Method 3
The image sensing chips are respectively disposed inside the second passing openings and electrically connected with the circuit substrate by wire bonding
Data Source
AI summary
A portable electronic device and an image capturing module thereof are disclosed. The image capturing module includes a circuit substrate, a structure reinforcing frame, a plurality of image sensing chips, an adhesive body, and a plurality of lens modules. The circuit substrate has a plurality of first passing openings. The structure reinforcing frame is disposed on the circuit substrate, and the structure reinforcing frame has a plurality of second passing openings respectively communicated with the first passing openings. The image sensing chips is electrically connected with the circuit substrate by wire bonding, and the image sensing chips are coplanarly disposed on a datum plane. The adhesive body is connected between each image sensing chip and the structure reinforcing frame. The lens modules are disposed on the circuit substrate, and the lens modules respectively correspond to the image sensing chips.