Image Carrier Silencer Bonding for Thermal Deformation
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Solution Overview
Problem
The existing image formation apparatuses face issues with image quality deterioration due to deformation of the image carrier member caused by differences in thermal expansion coefficients between the image carrier member and the silencer, leading to uneven density in printed images.
Innovation Solution
An image carrier with a cylindrical member featuring an image carrier layer and one or more silencers bonded using a bonding member, where the bonding range is defined by a length in the axial direction greater than in the circumferential direction, and the bonding area is discontinuous in the circumferential direction, using cyanoacrylate or epoxy-based adhesives to secure the silencers to the image carrier member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If silencers are bonded to the image carrier member, then noise reduction is achieved, but surface deformation occurs due to thermal expansion coefficient differences
Solution Approach 1:
The bonding areas are segmented into multiple discrete regions distributed around the silencer's circumferential direction, rather than continuous bonding. This segmentation allows differential thermal expansion while maintaining overall structural integrity and noise reduction effectiveness.
Solution Approach 2:
The bonding member is applied locally at specific bonding areas rather than uniformly across the entire interface. This localized bonding provides sufficient attachment for noise reduction while leaving other areas free to accommodate thermal expansion differences without causing surface deformation.
2Strength
If continuous bonding is applied around the silencer, then bonding strength is maximized, but image quality deteriorates due to surface deformation
Solution Approach 1:
The continuous bonding is segmented into multiple discrete bonding areas around the silencer. This segmentation maintains sufficient bonding strength for structural integrity and noise reduction while preventing the cumulative stress that causes surface deformation and image quality deterioration.
Solution Approach 2:
Instead of complete continuous bonding, partial bonding at specific discrete areas is applied. This partial action provides adequate bonding strength for the application while avoiding excessive bonding that would constrain thermal expansion and cause surface deformation.
3Stability of the object's composition
If bonding areas are small, then thermal expansion stress is reduced, but bonding strength becomes insufficient
Solution Approach 1:
Multiple segmented bonding areas are distributed around the silencer's circumferential direction. While each individual bonding area is relatively small to accommodate thermal expansion, the cumulative effect of multiple areas provides sufficient total bonding strength.
Solution Approach 2:
Multiple discrete bonding areas are combined around the silencer to achieve cumulative bonding strength. The combined effect of several small bonding areas provides both the stress relief of small individual areas and the overall strength of a larger bonding configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses surface deformation and prevents defects like uneven image density, enhancing image quality and impact resistance while maintaining the followability of the silencer with the image carrier member.
Implementation Method 1
a bonding member that bonds the one or more silencers to an inner circumferential surface of the image carrier member
Implementation Method 2
The silencer provides an effect of reducing noise generated by the photosensitive drum during printing operations
Data Source
AI summary
An image carrier according to one or more embodiments may include: a cylindrical image carrier member including an outer circumferential surface formed with an image carrier layer configured to carry a developer image; one or more silencers disposed in the image carrier member; and a bonding member that bonds the one or more the silencers to an inner circumferential surface of the image carrier member. For each silencer, the inner circumferential surface of the image carrier member includes one or more bonding areas to which the bonding member is attached. A bonding range, in which the one or more bonding areas are fit, for each silencer, has a length thereof in an axial direction of the silencer being greater than a length thereof in a circumferential direction of the silencer.