Image Detector Bonding Strength via Composite Insulating Films
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Solution Overview
Problem
The existing image detectors with active matrix substrates face detachment issues due to insufficient bonding strength between the resin material and the TFT array substrate, leading to creeping discharges and wire breakages, especially under temperature changes.
Innovation Solution
An image detector design that incorporates an inorganic insulating film around the semiconductor layer to enhance bonding between the insulating bonding member and the active matrix substrate, along with an organic insulating film providing openings for improved adhesiveness and reduced voltage impact on signal wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin material is used to cover end portions of semiconductor layer, then wire breakages are prevented, but detachment occurs at interface between resin material and TFT array substrate due to insufficient bonding strength
Solution Approach 1:
The patent applies composite materials by combining organic insulating film and inorganic insulating film in a layered structure. The inorganic insulating film is disposed on the TFT array substrate, and the organic insulating film is disposed on the inorganic insulating film, creating a composite bonding interface that enhances overall bonding strength and prevents detachment while maintaining wire protection functionality.
2Shape
If organic insulating film is used on TFT array substrate, then deposition surface is flattened, but bonding strength between resin material and organic insulating material is weak leading to detachment
Solution Approach 1:
The patent resolves this contradiction by creating a composite insulating film structure where an inorganic insulating film is disposed on the TFT array substrate, and an organic insulating film is disposed on the inorganic insulating film. This composite structure combines the surface flattening capability of organic materials with the superior bonding strength of inorganic materials, achieving both flat deposition surface and strong bonding.
Solution Approach 2:
The patent applies local quality by having different insulating films serve different functions at different locations. The inorganic insulating film provides strong bonding at the interface with the TFT array substrate, while the organic insulating film provides surface flatness for subsequent resin material deposition. Each layer is optimized for its specific local function.
3Power
If high voltage is applied to upper electrode, then X-ray detection is enabled, but creeping discharges occur from upper electrode to wires through semiconductor layer surface
Solution Approach 1:
The patent converts the harmful effect of high voltage by using the inorganic insulating film to suppress creeping discharges. The insulating film acts as a protective barrier that prevents the high voltage from causing discharge along the wire surfaces, thereby converting the high voltage condition from harmful to beneficial for X-ray detection while eliminating the discharge problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents detachment and creeping discharges, ensuring stable bonding and reducing the risk of wire breakages by enhancing the adhesiveness between the insulating bonding member and the active matrix substrate, while also reducing voltage effects on signal wires.
Implementation Method 1
the insulating bonding member is bonded to the active matrix substrate through an inorganic insulating film disposed in an area around the periphery of the semiconductor layer
Implementation Method 2
a semiconductor layer which generates charges according to an electromagnetic wave representing image information irradiated thereon
Implementation Method 3
resin material 119 is filled in a space between the semiconductor layer 116/upper electrode 117 and protection substrate 118... covering end portions of the semiconductor layer 116 with the resin material 119
Data Source
AI summary
An image detector which includes an active matrix substrate and a protection substrate bonded to the active matrix substrate by an insulating bonding member, in which the insulating bonding member is bonded to the active matrix substrate through an inorganic insulating film disposed in an area around the periphery of the semiconductor layer.