Image Detector Multi-Layer Insulation for Wiring Short Prevention

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Solution Overview

Problem

The existing X-ray inspection systems face issues with shorts between wiring and conductive covers due to pressure application, leading to display defects, especially when using a single layer of inorganic insulation film, which increases manufacturing costs and reduces productivity.

Innovation Solution

An image detector with an active matrix-type TFT array substrate featuring a conductive cover adhered above the data and bias lines, with at least two layers of inorganic insulation films between these lines and the conductive cover, preventing shorts and enhancing durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single layer of inorganic insulation film is used between wiring and conductive cover, then manufacturing cost is reduced, but short between wiring and conductive cover occurs due to pressure application

Engineering Contradiction:
Improvemanufacturing costVSAvoidshort prevention
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The single layer of inorganic insulation film is divided into multiple layers (first inorganic insulation film and second inorganic insulation film). This segmentation increases the total insulation thickness and provides redundant protection, ensuring that even if one layer is compromised by pressure, the other layers prevent short between the wiring and conductive cover.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies multiple layers of inorganic insulation film in advance before the conductive cover is attached. This beforehand cushioning creates a robust insulation barrier that anticipates and prevents the harmful effect of pressure-induced shorting, ensuring reliability without requiring complex additional structures.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If more layers of inorganic insulation film are used to prevent short, then reliability is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveshort preventionVSAvoidinsulation film structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies the multi-layer inorganic insulation film structure specifically in the peripheral part of the array substrate where the conductive cover is attached, rather than uniformly across the entire substrate. This local quality approach provides enhanced insulation where it is most needed (under the conductive cover) while maintaining simplicity in other areas.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses a composite structure combining multiple layers of inorganic insulation films with different properties (e.g., different thicknesses, different material compositions). This composite approach provides superior insulation performance and short prevention while managing the overall complexity through systematic material selection and layering.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses shorts between wiring and the conductive cover, reducing display defects and maintaining productivity while minimizing manufacturing costs.

Implementation Method 1

a conversion layer, which is arranged on the TFT array substrate and converts radiation into light

Methodology Applied
Scientific EffectScintillation: Scintillation

Data Source

PatentUS8735886B2Image detector
Publication Date: 2014.05.27 TRIVALE TECHNOLOGIES LLC
  • US8735886B2 patent drawing
  • US8735886B2 patent drawing
  • US8735886B2 patent drawing

AI summary

An image detector comprises: an active matrix-type TFT array substrate having a pixel area, in which photoelectric conversion elements and thin film transistors are arranged in a matrix shape, a data line, and a bias line; a conversion layer, which is arranged on the TFT array substrate and converts radiation into light; and a conductive cover, which covers the conversion layer, wherein the conductive cover is adhered in an adhesion area in an upper layer than an area, in which at least one of the data line and the bias line extend from the pixel area to each of terminals, and wherein inorganic insulation films configured by at least two layers are formed between the at least one of the data line and the bias line and the adhesion area.