Integrated Image Distance Sensor for Vehicle Rear Monitoring

Solution Overview

Problem

Existing combined solutions for reverse radar and reverse image devices in vehicles suffer from low integration, large volume, and high costs due to separate components for distance sensing and image sensing.

Innovation Solution

An image distance sensor is developed, integrating image sensing and distance sensing units on a semiconductor substrate in the same manufacturing process, incorporating a pixel circuit, photosensitive unit, and ultrasonic sensing unit, with a resonant cavity and piezoelectric layer, to provide both functions in a single sensor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate reverse radar and reverse image devices are used, then both distance measurement and image display functions are achieved, but device volume and cost increase

Engineering Contradiction:

Improvedual function capabilityVSAvoidsensor volume

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent combines the image sensing unit and distance sensing unit into a single integrated sensor device. The image sensing unit includes pixel circuits and photosensitive units, while the distance sensing unit includes ultrasonic sensing elements, all formed on the same semiconductor substrate through the same manufacturing process. This merging eliminates the need for separate reverse radar and reverse image devices, reducing overall device volume while maintaining both distance measurement and image display functions.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated sensor device performs multiple functions simultaneously: it captures images through the image sensing unit and measures distance through the distance sensing unit. The semiconductor substrate is designed to accommodate both types of sensing elements, enabling a single device to replace multiple separate components and provide versatile functionality for vehicle rear-end monitoring.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If separate reverse radar and reverse image devices are used, then both distance measurement and image display functions are achieved, but manufacturing cost increases

Engineering Contradiction:

Improvedual function capabilityVSAvoidproduction cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines the image sensing unit and distance sensing unit into a single integrated sensor device. The image sensing unit includes pixel circuits and photosensitive units, while the distance sensing unit includes ultrasonic sensing elements, all formed on the same semiconductor substrate through the same manufacturing process. This merging eliminates the need for separate reverse radar and reverse image devices, reducing overall device volume while maintaining both distance measurement and image display functions.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated sensor device performs multiple functions simultaneously: it captures images through the image sensing unit and measures distance through the distance sensing unit. The semiconductor substrate is designed to accommodate both types of sensing elements, enabling a single device to replace multiple separate components and provide versatile functionality for vehicle rear-end monitoring.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Volume of moving object

If integrated image and distance sensing is implemented, then device compactness and cost are reduced, but manufacturing process complexity increases

Engineering Contradiction:

Improvesensor volumeVSAvoidmanufacturing process complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent combines the image sensing unit and distance sensing unit into a single integrated sensor device. The image sensing unit includes pixel circuits and photosensitive units, while the distance sensing unit includes ultrasonic sensing elements, all formed on the same semiconductor substrate through the same manufacturing process. This merging eliminates the need for separate reverse radar and reverse image devices, reducing overall device volume while maintaining both distance measurement and image display functions.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This integration improves the sensor's compactness, reduces production costs, and enhances functionality by organically combining image and distance sensing, overcoming the limitations of separate components.

Implementation Method 1

a piezoelectric layer formed on the first insulating layer

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

a resonant cavity formed in the semiconductor substrate

Methodology Applied

Scientific EffectResonance: Resonance

Implementation Method 3

a photosensitive unit comprises: a third well region formed in the semiconductor substrate, the third well region being provided with a third doping region, and the third doping region and the third well region having different semiconductor types

Methodology Applied

Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS11195868B2Image distance sensor and manufacture method thereof as well as a ranging device

Publication Date: 2021.12.07 BEIJING BOE DISPLAY TECH CO LTD

AI summary

This disclosure provides an image distance sensor and a manufacture method thereof, as well as a ranging device. The image distance sensor includes a semiconductor substrate, and an image sensing unit and a distance sensing unit formed on the semiconductor substrate. The image sensing unit and the distance sensing unit are formed in a same manufacture process.