Image Forming Apparatus Vertical Substrate Cooling
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Solution Overview
Problem
Conventional image forming apparatuses face noise issues due to the use of small fans operating at high speeds to generate airflow for heat dissipation, which limits the arrangement space and increases noise levels.
Innovation Solution
The apparatus incorporates a chassis design with a cooling air channel that directs airflow vertically between the image forming section and a vertically arranged circuit board, allowing for a larger fan diameter to operate at lower speeds, reducing noise while effectively dissipating heat from heat source devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a small fan is used to generate airflow for heat dissipation, then the arrangement space is reduced, but the noise level increases due to high-speed rotation
Solution Approach 1:
The patent changes the arrangement dimension of substrates from horizontal to vertical orientation. This dimensional change allows the fan to be positioned in the height direction rather than occupying horizontal space, enabling a larger fan diameter without increasing the apparatus footprint. The vertical arrangement of substrates creates unused vertical space that can accommodate a larger fan while maintaining compact horizontal dimensions.
Solution Approach 2:
The patent introduces asymmetric arrangement of components, specifically positioning the fan in the height direction away from substrates rather than symmetrically adjacent to them. This asymmetric placement optimizes airflow patterns and allows the fan to operate at lower speeds with reduced noise while effectively cooling the vertically arranged substrates.
2Ease of manufacture
If substrates are arranged horizontally inside the apparatus main body, then the layout is conventional, but the space in the height direction is individually occupied limiting fan size
Solution Approach 1:
The patent inverts the conventional horizontal arrangement of substrates by arranging them vertically. This inversion allows the fan to be positioned in the height direction, utilizing previously unused vertical space. The inversion transforms the spatial utilization from horizontal occupation to vertical occupation, enabling larger fan diameter without increasing horizontal footprint.
3Reliability
If a fan is arranged adjacent to a heat source device, then the cooling is direct, but the arrangement space of the fan is limited
Solution Approach 1:
The patent introduces a cooling air channel as an intermediary between the fan and the vertically arranged substrates. The air channel guides airflow from the fan positioned in the height direction to the substrates, ensuring effective cooling despite the non-adjacent arrangement. This intermediary structure enables both large fan diameter and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a significant reduction in noise levels by allowing a larger fan to operate at lower speeds, improving heat dissipation efficiency and minimizing space occupancy within the apparatus.
Implementation Method 1
The fan is rotationally driven to cause an airflow to flow into the internal space
Implementation Method 2
The first cooling air channel is arranged in the internal space and sends the airflow toward the circuit board
Data Source
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AI summary
An image forming apparatus (1) includes a chassis (10), an image forming section, a fan (80), a circuit board (70), and a first cooling air channel. The chassis includes a first surface and a second surface that is opposite to the first surface. The image forming section is arranged in an internal space (S) formed between the first surface and the second surface of the chassis and performs an image forming process on a sheet. The fan is arranged between the first surface and the image forming section and is rotationally driven to cause an airflow to flow into the internal space. The circuit board is vertically arranged between the second surface and the image forming section. The first cooling air channel is arranged in the internal space and sends the airflow toward the circuit board.