Housing-Free Image Capture Module With Adhesive Light Blocking
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Solution Overview
Problem
The existing image capturing units in consumer electronic devices face challenges in reducing size due to housing requirements and suffer from light leakage when manufactured without a housing, affecting image quality.
Innovation Solution
An image capturing module with a lens set covered by a first adhesive layer, and additional adhesive layers that include sub-layers laminated sequentially, are used to eliminate the need for a housing and prevent light leakage, allowing for a smaller module size and improved image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a housing is used to support and assemble the lens set, then the lens set is protected and assembled, but the size of the image capturing unit increases
Solution Approach 1:
The patent removes the housing from the image capturing unit structure, extracting only the essential light-blocking function. The side surface of the lens set is left exposed without housing coverage, eliminating the size increase while maintaining core functionality through alternative light leakage prevention methods
Solution Approach 2:
The patent employs a thin film adhesive layer applied to the light incident surface of the lens set to prevent light leakage from side surfaces. This thin film approach replaces the bulky housing structure, achieving light leakage prevention without increasing the overall unit size
2Volume of moving object
If the housing is removed to reduce size, then the size is reduced, but light leakage occurs affecting image quality
Solution Approach 1:
A thin film adhesive layer is applied to the light incident surface of the lens set to block light leakage from side surfaces. This thin film solution prevents harmful light leakage without requiring the bulky housing structure, thus reducing size while maintaining image quality
Solution Approach 2:
The adhesive layer serves as an intermediary element between the lens set and the external environment. It performs the light-blocking function that would otherwise require housing, acting as a mediator that prevents light leakage while enabling the housing-less compact design
3Device complexity
If wafer-level process is used to combine optical sensing chip and lens set, then housing is eliminated, but side surface light leakage occurs
Solution Approach 1:
The wafer-level bonding process integrates the lens set and optical sensing chip in a planar configuration, and a thin film adhesive layer is applied to the light incident surface to prevent side surface light leakage. This maintains the simple structure while addressing the light leakage issue
Solution Approach 2:
The patent addresses light leakage not by adding vertical housing structure but by applying a thin film layer on the light incident surface of the lens set. This dimensional approach to light blocking prevents leakage from side surfaces while maintaining the compact wafer-level integrated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the size of the image capturing module and enhances image quality by covering the side surfaces of the lens set and using inkjet printing for precise adhesive layer formation, effectively blocking light leakage and stabilizing the lens arrangement.
Implementation Method 1
The first adhesive layer covers the side surface of the lens set... the first adhesive layer covering the side surface of the lens set can avoid light leakage
Implementation Method 2
The second adhesive layer is disposed on the light incident surface or disposed between the light emitting surface and the image capturing unit
Data Source
AI summary
An image capturing module including an image capturing unit, a lens set and a first adhesive layer is provided. The lens set is disposed on the image capturing unit. The lens set has a light incident surface and a light emitting surface opposite to each other and has at least one side surface, the light emitting surface faces the image capturing unit, and the side surface is connected between the light incident surface and the light emitting surface. The first adhesive layer covers the side surface of the lens set. In addition, a manufacturing method of the image capturing module is also provided.


