Image Pickup Module Resin Layout for Gap-Free Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image pickup modules face challenges in efficiently sealing electronic components and underfill resin without gaps or interfaces, leading to potential reliability issues.
Innovation Solution
A method involving a wiring board with a cutout that allows continuous resin filling between the imager and wiring board surfaces, eliminating interfaces and ensuring seamless integration of resins to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate resin filling methods are used for different spaces, then manufacturing simplicity is maintained, but resin interfaces and gaps are created reducing reliability
Solution Approach 1:
The patent merges the resin filling process for multiple separate spaces (first space between imager and wiring board, second space in recess, third space in cutout) into a single continuous resin mass. By eliminating the barriers between these spaces and allowing resin to flow continuously throughout, the invention eliminates interfaces that would otherwise create gaps and reliability issues, directly resolving the contradiction between sealing reliability and structural simplicity.
Solution Approach 2:
The patent segments the wiring board structure into distinct functional zones (first space for imager bonding, second space for component mounting, third space for cutout access) while designing the resin filling process to treat these segments as a unified continuous medium. This segmentation allows each zone to serve its specific function while the continuous resin ensures seamless sealing across all zones, resolving the contradiction between functional differentiation and sealing integrity.
2Reliability
If multiple resin filling steps are used, then complete sealing is achieved, but manufacturing complexity and time increase
Solution Approach 1:
The patent implements a single continuous resin filling operation that simultaneously fills the first space, second space, and third space without requiring multiple separate filling steps. By maintaining continuous resin flow throughout the entire filling process and eliminating intermediate steps, the invention achieves complete sealing of all bonding portions while significantly improving manufacturing efficiency, directly resolving the contradiction between sealing completeness and productivity.
3Reliability
If resin is filled continuously through cutout, then interface elimination is achieved, but control of resin distribution becomes more difficult
Solution Approach 1:
The patent uses the cutout structure as an intermediary channel that facilitates controlled resin distribution. The cutout acts as a deliberate design feature that guides resin flow from the injection point through the first space into the second and third spaces. This intermediary structure provides a controlled pathway for resin distribution while enabling continuous filling and interface elimination, resolving the contradiction between reliability and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable sealing of bonding portions without gaps, enhancing the overall reliability and ease of manufacturing of the image pickup module.
Implementation Method 1
a liquid resin to continuously fill each of the recess, the cutout and the space between the back surface and the first surface
Implementation Method 2
curing the resin in each of the recess, the cutout and the gap
Data Source
AI summary
An image pickup module includes: an imager including a light receiving surface; and a back surface opposite to the light receiving surface; a wiring board including a first surface, a bottom surface disposed in a recess surrounded by a plurality of walls, a plurality of electronic components configured to mount on the bottom surface; and a cutout communicating a first space between the back surface and the first surface with a second space inside the recess, the cutout being on a first wall of the plurality of walls; and a resin disposed in the first space, the second space and a third space inside of the cutout, in which the resin is continuous without an interface between the first space, the second space, and the third space.