Image Pickup Module Assembly for Stable Solder Gap Alignment
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Solution Overview
Problem
The manufacturing of image pickup modules where the image pickup unit and wiring board are bonded with solder faces challenges such as potential inclination of the image pickup unit relative to the wiring board and variability in spacing, requiring additional steps like optical axis adjustment, making the process difficult.
Innovation Solution
The implementation of a protective member made of a first resin covering the side surfaces of the image pickup module, combined with a second resin between the image pickup unit and wiring board, and a projection from the protective member that defines the spacing, ensures precise alignment and bonding without inclination during solder melting, facilitating easy manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image pickup unit and wiring board are bonded with solder, then electrical connection is achieved, but the image pickup unit may incline relative to the wiring board causing variability in spacing
Solution Approach 1:
The protective member is designed with a projection that defines the spacing between the image pickup unit and wiring board before solder bonding occurs. This preliminary positioning structure ensures that even when solder melts and flows, the image pickup unit maintains consistent spacing and does not incline relative to the wiring board.
Solution Approach 2:
The protective member acts as an intermediary component between the image pickup unit and wiring board. Its projection physically defines and maintains the spacing, mediating the relationship between the two components during solder bonding and preventing direct contact that would cause inclination.
2Manufacturing precision
If optical axis adjustment is performed to ensure proper alignment, then image quality is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The protective member's projection is designed to automatically position the image pickup unit at the correct optical axis alignment before solder bonding. This preliminary mechanical positioning eliminates the need for subsequent optical axis adjustment steps, simplifying the manufacturing process while ensuring precision.
Solution Approach 2:
The protective member provides self-alignment functionality through its projection structure. The image pickup unit automatically achieves proper optical axis alignment through the mechanical constraint of the projection, without requiring external adjustment mechanisms or complex manufacturing processes.
3Volume of moving object
If the image pickup unit is positioned close to the wiring board to reduce module size, then compactness is improved, but spacing variability increases during solder bonding
Solution Approach 1:
The protective member's projection defines the spacing at an optimal value that balances compactness and precision. By establishing this spacing beforehand, the design achieves minimal module size while preventing spacing variability during solder bonding, as the projection maintains consistent distance even when solder melts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution stabilizes the image pickup unit's position relative to the wiring board, eliminating the need for optical axis adjustment and ensuring consistent spacing, thereby simplifying the manufacturing process and enhancing the reliability of the bonding.
Implementation Method 1
melting the solder, to thereby bring the projection into contact with the fifth principal surface
Implementation Method 2
a solder that bonds the bonding electrode and the external electrode
Data Source
AI summary
An image pickup module includes: a lens unit including a first principal surface and a second principal surface; an image pickup unit including a third principal surface and a fourth principal surface on which an external electrode is disposed; a wiring board including a hole and a bonding electrode disposed on a bottom surface of the hole; a solder that bonds the bonding electrode and the external electrode; a rigid member that defines a spacing between the fourth principal surface and the bottom surface; and a second resin disposed between the fourth principal surface and the bottom surface.