Image Pickup Device Fixing Member Adhesive Bonding
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Solution Overview
Problem
Existing image pickup apparatuses face challenges in downsizing and achieving high-strength fixation of image pickup devices, particularly in digital single-reflex cameras, due to the need for screw mounting and the limitations of adhesive-based bonding methods when automatic mounting is employed, which compromises shock resistance.
Innovation Solution
An image pickup apparatus with a fixing member that includes an abutment surface and a wall portion to securely attach the image pickup device, using an adhesive to fill the space between the device and the wall portion, allowing for compact and high-strength fixation without the need for screw mounting, while also incorporating a thermally-conductive sheet for heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws are used to fasten the image pickup device to the mounting portion, then the mechanical strength and shock resistance are improved, but the space required for screw mounting increases the overall size of the image pickup apparatus
Solution Approach 1:
The patent replaces the mechanical screw fastening system with a chemical bonding system using adhesive. The adhesive is applied to the rear surface of the image pickup device and bonds it to the mounting portion, eliminating the need for screw holes and mechanical fasteners. This substitution achieves both downsizing (by removing screw mounting space) and maintains bonding strength through the adhesive material.
2Volume of moving object
If adhesive bonding is used to fix the image pickup device, then the size of the image pickup apparatus is reduced, but the bonding strength and shock resistance are insufficient compared to screw fastening
Solution Approach 1:
The patent employs a composite bonding structure where adhesive material is applied in a specific pattern (along peripheral portions and intermediate portions) to create multiple bonding zones. This composite bonding approach distributes stress across multiple areas, enhancing overall bonding strength and shock resistance while maintaining the compact size advantage of adhesive bonding over screw fastening.
3Reliability
If a rigid holding structure is used to firmly hold the image pickup device for shock resistance, then the shock resistance is improved, but the device complexity and space requirements increase
Solution Approach 1:
The patent divides the bonding structure into multiple segmented bonding zones by applying adhesive to peripheral portions and intermediate portions separately. This segmentation allows the bonding structure to flex and distribute shock forces across multiple discrete bonding points rather than requiring a single complex rigid structure, thereby achieving shock resistance with simpler overall design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the compact downsizing of image pickup devices while enhancing mechanical strength and shock resistance, improving bonding efficiency and reducing production time through the use of light-curing adhesives and facilitating easy integration with automatic mounting processes.
Implementation Method 1
an adhesive configured to be filled in a space formed between the side surface of the image pickup device and the wall portion
Implementation Method 2
the use of light-curing adhesives
Data Source
AI summary
An image pickup apparatus which is capable of fixing an image pickup device compactly and with high strength. A wiring substrate has an image pickup device mounted thereon. A fixing member is fixed on the image pickup device. The fixing member is provided with an abutment surface that comes into abutment with the image pickup device, an opening from which a light-incident surface of the image pickup device is exposed, and a wall portion that faces a side surface of the image pickup device. An adhesive is filled in a space formed between the side surface of the image pickup device and the wall portion.