Image Pickup Guard Ring Humidity Resistance
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Solution Overview
Problem
Image pickup apparatuses with low-dielectric constant material insulating layers face reliability issues due to insufficient humidity resistance, leading to potential water permeation and signal delays or malfunction, especially in high temperature and high humidity environments.
Innovation Solution
The implementation of a guard ring made from materials superior to low-dielectric constant materials in humidity resistance, combined with a transparent cover glass and sealing resin, effectively blocks water permeation from both sides and above, enhancing the reliability of the image pickup apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a guard ring made of humidity-resistant material is added to block water permeation, then the reliability is improved, but the device structure becomes more complex
Solution Approach 1:
The patent combines the guard ring function with the existing electrode pad structure, where the guard ring encloses the image pickup section, circuit section, and electrode pads in an integrated manner. This merging approach adds protective functionality without requiring completely separate structural elements.
Solution Approach 2:
The transparent adhesive layer serves multiple functions simultaneously: it adheres the cover glass to the substrate, provides additional humidity barrier protection, and maintains optical transparency for light transmission. This multi-functionality reduces the need for separate components, simplifying the overall structure while improving reliability.
2Reliability
If a transparent adhesive layer is added to cover the entire front surface to block water permeation, then the humidity resistance is improved, but the light transmittance may be affected
Solution Approach 1:
The patent specifies that the transparent adhesive layer must have particular optical properties (high light transmittance) and physical properties (humidity resistance). By carefully selecting materials that meet these parameter requirements, the adhesive layer provides water permeation protection while maintaining sufficient light transmission for image pickup functionality.
Solution Approach 2:
The patent emphasizes the transparency of the adhesive layer, which relates to its optical properties. By using a transparent (optically neutral) adhesive material, the layer provides protective functionality without absorbing or reflecting significant light, thus maintaining high light transmittance for the image pickup section.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the reliability of the image pickup apparatus by preventing water ingress, maintaining performance even in harsh environments, and ensuring high productivity without compromising light transmittance or design flexibility.
Implementation Method 1
a transparent member adhered to the first primary surface of the image pickup device chip via a transparent adhesive layer
Implementation Method 2
an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide
Implementation Method 3
the guard ring enclosing the image pickup section, the circuit section and the electrode pads and being made of one or more materials selected from materials superior to the low dielectric constant material in humidity resistance
Data Source
AI summary
An image pickup apparatus includes an image pickup device chip having a first primary surface on which an image pickup section, a circuit section and a guard ring are formed, the circuit section having a plurality of layers including an insulating layer that is made of a low dielectric constant material having a relative dielectric constant lower than silicon oxide, the guard ring being made of one or more materials selected from materials superior to the low dielectric constant material in humidity resistance; and a cover glass adhered to the first primary surface of the image pickup device chip.