Image Pickup Apparatus Heat Dissipation Sheet Vertical Arrangement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image pickup apparatuses face challenges in efficiently dissipating heat from small image pickup devices with electrode pads on all sides, leading to increased internal temperatures and potential overheating, especially when arranged in compact and thin designs.
Innovation Solution
The image pickup apparatus incorporates a heat dissipation sheet thermally connected to a copper foil exposed area on the image pickup device's substrate, allowing heat to be efficiently conducted to the exterior of the camera body, while the main board unit is arranged to surround the lens unit in a parallel configuration, optimizing space and reducing overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a small image pickup device with electrode pads on all sides is used to miniaturize the apparatus, then the apparatus size is reduced, but heat dissipation becomes difficult and internal temperature rises
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by arranging the main board unit vertically along the optical axis direction. The heat dissipation plate extends in the vertical direction with fins that protrude laterally, creating a multi-dimensional heat dissipation structure that efficiently dissipates heat from compact image pickup devices without increasing overall apparatus volume.
Solution Approach 2:
The patent implements nested arrangement where the main board unit containing the image pickup device is positioned within the lens unit structure. The heat dissipation plate is integrated with the main board unit, and fins are attached to the heat dissipation plate, creating a compact nested configuration that maximizes heat dissipation surface area within limited space.
2Temperature
If heat dissipation structures are added to the substrate, then heat dissipation capability is improved, but the substrate area available for electrode pad connections is reduced
Solution Approach 1:
The patent resolves this contradiction by moving heat dissipation structures from the two-dimensional substrate plane to the three-dimensional vertical direction. The heat dissipation plate extends vertically from the substrate surface, and fins protrude laterally from the plate, creating heat dissipation surfaces in multiple dimensions without occupying substrate area needed for electrode pad connections.
Solution Approach 2:
The patent introduces a heat dissipation plate as an intermediary component between the substrate and the external environment. This plate serves as a thermal conductor that transfers heat from the substrate to the fins, which then dissipate heat to the surrounding air, thereby separating the heat dissipation function from the substrate connection function.
3Length of stationary object
If the main board unit is arranged parallel to the lens unit side to reduce vertical thickness, then the digital camera thickness is reduced, but heat dissipation space is limited
Solution Approach 1:
The patent implements nested arrangement where the main board unit is positioned within the lens unit structure, and the heat dissipation plate with fins is integrated into this nested configuration. The fins extend into the limited space available within the lens unit, maximizing heat dissipation surface area without increasing the overall vertical thickness of the digital camera.
Solution Approach 2:
The patent utilizes the vertical direction along the optical axis to arrange the heat dissipation plate and fins, creating a multi-dimensional heat dissipation structure that efficiently uses the limited space within the compact camera body while maintaining reduced vertical thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat dissipation for image pickup devices with electrode pads on all sides, preventing overheating and allowing for a thinner digital camera design without increasing the vertical thickness of the lens unit and main board unit.
Implementation Method 1
a heat dissipation sheet configured to be thermally connected to the heat dissipation section at one end, and to be thermally connected to an exterior of an apparatus body at the other end
Data Source
AI summary
An image pickup apparatus that is capable of dissipating heat generated by an image pickup device efficiently, even when a small image pickup device that has electrode pads on almost all the back face is used. The image pickup apparatus has a lens assembly. An image pickup device photoelectrically converts subject light that is incident on the lens assembly. The image pickup device is implemented at one side of a device substrate. A heat dissipation section that dissipates heat generated by the image pickup device is provided at the other side of the device substrate. A heat dissipation sheet is thermally connected to the heat dissipation section at one end, and is thermally connected to an exterior of an apparatus body at the other end.