Image Pickup Thermal Layout Using Sheet Metal Heat Paths

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Solution Overview

Problem

Existing image pickup apparatuses face challenges in efficiently dissipating heat without increasing their size, particularly in compact designs, as conventional heat dissipation methods often limit the conduction paths and may not adequately release heat from small devices.

Innovation Solution

The apparatus incorporates a first sheet metal member with an arm portion extending in the optical axis direction, thermally connected to the image pickup device board, and a battery chamber, along with heat transfer plates, to create efficient heat dissipation paths that do not enlarge the device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a flexible heat transfer member connects the heat generating element to the chassis member, then heat dissipation efficiency is improved, but the conduction destination is limited and heat cannot be sufficiently released from small devices

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidheat conduction paths
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The heat dissipation system is segmented into multiple independent heat transfer paths: (1) image pickup device to first sheet metal member, (2) first sheet metal member to battery chamber, and (3) first sheet metal member to grip portion. This segmentation allows heat to be conducted through multiple separate routes simultaneously, increasing overall heat dissipation efficiency without requiring a single large conduction path.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first sheet metal member serves multiple functions: it acts as a heat transfer plate for the image pickup device, extends as an arm portion to conduct heat to the battery chamber, and also functions as a structural component connecting to the grip portion. This multi-functionality allows a single component to provide multiple heat conduction paths, resolving the limitation of having insufficient conduction destinations in compact devices.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If heat dissipation structures are added to release heat effectively, then heat dissipation performance is improved, but the device size increases

Engineering Contradiction:
Improveheat dissipation performanceVSAvoiddevice size
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The heat dissipation structure is merged with the existing structural components of the camera. The first sheet metal member is integrated into the body structure, and the arm portion extends from this member to reach the battery chamber. By combining heat transfer functions with structural elements, heat dissipation performance is improved without adding separate heat sink components that would increase device volume.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The arm portion extends in the optical axis direction (depth dimension) rather than expanding the device in lateral dimensions. This allows heat to be conducted to the battery chamber which is positioned along the optical axis, utilizing the existing depth of the device structure. This dimensional approach enables heat dissipation without increasing the device's width or height, maintaining compact form factor.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables high heat dissipation performance while maintaining the compact size, allowing for extended continuous shooting times, especially in moving image capture.

Implementation Method 1

the first sheet metal member is thermally connected to the image pickup device board... the first arm portion is disposed at a position closer to the optical axis than the battery chamber

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12506940B2Image pickup apparatus with high heat dissipation performance
Publication Date: 2025.12.23 CANON KK
  • US12506940B2 patent drawing
  • US12506940B2 patent drawing
  • US12506940B2 patent drawing

AI summary

An image pickup apparatus having high heat dissipation performance. The image pickup apparatus comprises a board having an image pickup device, a sheet metal member disposed closer to a front surface side than the board and adjacent to the board in an optical axis direction, an electronic component board disposed closer to a back surface side than the board, and a battery chamber disposed near an outer edge of the board. The sheet metal member is thermally connected to the board, and includes an arm, which is formed integrally with and made of the same material with the sheet metal member. The arm extends in the optical axis direction toward the back surface side, to a position closer to the back surface side than the board, and is disposed at a position closer to the optical axis than the battery chamber.