Image Pickup Module Flying Lead Bonding via Protruding Wiring Board
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Solution Overview
Problem
Existing image pickup modules face challenges in accurately bonding flying leads to electrodes due to overlapping end surfaces of the image pickup chip and wiring board, making visual confirmation and precise positioning difficult, which affects bonding reliability and yield.
Innovation Solution
The image pickup module incorporates flying leads protruded from the wiring board's end surface, sealed with a resin, allowing for visual confirmation and precise alignment during bonding, ensuring high reliability and yield by using energy-based bonding methods like ultrasonic or thermal bonding, and employing a transparent adhesion layer for the prism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the end surface of the wiring board and the end surface of the image pickup chip overlap each other to reduce module size, then the compactness is improved, but the visual confirmation and positioning accuracy during bonding deteriorates
Solution Approach 1:
The patent extends the wiring board in the thickness direction (Z-axis) to create protruding portions that surpass the image pickup chip's end surface. This dimensional extension transforms the bonding interface from a coplanar overlap to a protruding structure, enabling visual confirmation and precise positioning while maintaining the compact overall module design.
2Device complexity
If flying leads are used to connect electrodes to reduce wiring complexity, then the device complexity is reduced, but the bonding reliability deteriorates due to difficulty in visual confirmation
Solution Approach 1:
The wiring board's end surface is extended in advance to form protruding portions that expose the flying leads before the bonding process. This preliminary structural preparation enables visual confirmation and precise positioning of the flying leads, ensuring reliable bonding while maintaining the simplified wiring architecture.
3Length of stationary object
If the wiring board end surface overlaps with the image pickup chip end surface, then the overall length is reduced, but the ease of operation during bonding deteriorates
Solution Approach 1:
The wiring board is segmented into a main body portion and protruding portions that extend beyond the image pickup chip. This segmentation allows the bonding operation to be performed on the exposed protruding portions with ease, while the overall module length remains compact due to the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables accurate and reliable bonding of electrodes to flying leads, enhancing the connection strength and reducing the risk of damage to the semiconductor circuit, resulting in a high-reliability image pickup module suitable for compact applications like endoscopes.
Implementation Method 1
flying leads protruded from the wiring board's end surface, sealed with a resin
Implementation Method 2
using energy-based bonding methods like ultrasonic or thermal bonding
Implementation Method 3
using energy-based bonding methods like ultrasonic or thermal bonding
Data Source
AI summary
An image pickup module includes: an image pickup chip including a main surface on which a light-receiving portion of an image pickup device and a plurality of electrodes connected to the light-receiving portion are formed; and a wiring board including flying leads bonded to the respective plurality of electrodes.