Image Pickup Device Reference Pixel Selection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing imaging apparatuses face challenges in accurately forming cavities for temperature detection devices, insufficient integration time for signal output, limited flexibility in wavelength spectroscopic characteristics and infrared sensitivity, and high power consumption.

Innovation Solution

The imaging apparatus is designed with a substrate configuration featuring temperature detection devices arranged in a 2D matrix, drive lines, and signal lines connected to a drive circuit, allowing for precise cavity formation, extended integration time, adjustable wavelength sensitivity, and reduced power consumption through optimized electrical connections and material layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a reference pixel is selected from a wide range including pixels affected by the same defect, then diversity of reference pixels is improved, but measurement precision deteriorates due to inclusion of defective pixels

Engineering Contradiction:
Improvediversity of reference pixelsVSAvoiddark spot detection precision
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent applies local quality by making the selection of reference pixels position-dependent. Pixels at different positions relative to the defect have different weights in the selection process. Specifically, pixels closer to the defect position are given higher priority, while pixels farther away are excluded, creating a localized reference region that adapts to the defect's spatial characteristics.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses feedback by iteratively selecting reference pixels based on the calculated defect position and characteristics. The selection process feeds back into the defect detection algorithm, allowing the system to refine its reference pixel choices based on previous detection results, thereby improving both adaptability and precision.

Inventive Principle:
Principle #23Feedback

2Device complexity

If fixed reference pixels are used for defect detection, then device complexity is reduced, but measurement precision deteriorates when defect positions vary

Engineering Contradiction:
Improvereference pixel selection mechanismVSAvoiddefect detection precision
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent applies dynamics by making the reference pixel selection dynamic rather than fixed. The reference pixels are dynamically determined based on the calculated defect position and the spatial relationship between pixels. This dynamic adaptation allows the system to maintain high precision across various defect positions without significantly increasing device complexity.

Inventive Principle:
Principle #15Dynamics

3Reliability

If pixels far from the defect are included as reference pixels, then the number of reference pixels increases improving reliability, but measurement precision deteriorates due to larger distance variations

Engineering Contradiction:
Improvedefect detection reliabilityVSAvoidreference pixel accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent applies parameter changes by dynamically adjusting the selection criteria for reference pixels based on their spatial parameters relative to the defect. The selection process considers the distance parameter, prioritizing pixels with smaller distance values to the defect. This parameter-based selection ensures that reference pixels remain both numerous for reliability and close enough for precision.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP3370048B1Image pickup device
Publication Date: 2023.07.26 SONY SEMICON SOLUTIONS CORP
  • EP3370048B1 patent drawingFigure 1A~1B
  • EP3370048B1 patent drawingFigure 2A~2B
  • EP3370048B1 patent drawingFigure 3

AI summary

An imaging apparatus is configured of a first structure 20 and a second structure 40, in which the first structure 20 includes a first substrate 21, a plurality of temperature detection devices 15 formed on the first substrate 21 and configured to detect a temperature on the basis of an infrared ray, drive lines 72, and signal lines 71, the second structure 40 includes a second substrate 41, and a drive circuit provided on the second substrate 41 and covered with a covering layer 43, the first substrate 21 is bonded to the covering layer 43, a cavity 50 is provided between each temperature detection device 15 and the covering layer 43, and the drive lines 72 and the signal lines 71 are electrically connected to the drive circuit.