Image Pickup Device Terminal Layout for Reliable Soldering

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Solution Overview

Problem

Existing image pickup devices face challenges in maintaining soldering reliability due to increased output terminals, particularly with full-size devices where reinforcing terminals are needed to prevent shorting, but these solutions increase costs and complexity.

Innovation Solution

The image pickup device incorporates signal terminals on one surface with reinforcing terminals located between them and a holding fixing unit, ensuring reliable soldering without additional special members or adhesives, using a specific terminal and land layout on the mounting board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of output terminals is increased to accommodate more pixels, then the image pickup device can handle higher resolution, but the space between neighboring leads must be maintained which makes it difficult to place the required number of output terminals

Engineering Contradiction:
Improvenumber of output terminalsVSAvoidlayout complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent transitions from a two-dimensional lead arrangement on the sides of the device to a three-dimensional configuration where signal terminals are arranged on the bottom surface in multiple rows and columns. This dimensional change allows significantly more terminals to be packed into the same footprint area, enabling higher pixel counts without increasing the device's external dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Length of stationary object

If the diameter of output lands is reduced to maintain external dimensions of the LGA-PKG, then the device size is maintained, but the reliability of soldering decreases

Engineering Contradiction:
Improveexternal dimensionsVSAvoidsoldering reliability
Core Design Contradiction:
Length of stationary objectVSReliability

Solution Approach 1:

The patent divides the bottom surface into multiple signal terminal regions arranged in rows and columns, with each terminal having its own dedicated land area. This segmentation allows each land to be optimally sized for reliable soldering while the overall array fits within the required external dimensions. The systematic grid arrangement maximizes space utilization without compromising individual terminal quality.

Inventive Principle:
Principle #1Segmentation

3Reliability

If reinforcing terminals are placed on the bottom of the LGA-PKG to prevent shorting, then soldering reliability is improved, but the cost increases due to additional enclosing members

Engineering Contradiction:
Improvesoldering reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the signal terminal function with the reinforcing function by designing each signal terminal to have an enlarged land area that inherently provides mechanical reinforcement. The signal terminals are integrated into the mounting structure without requiring separate reinforcing terminals or enclosing members, thus achieving both electrical connection and structural strength simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of operation

If reinforcing terminals enclosed by enclosing members are used to improve ease of mounting, then workability is improved, but the cost increases and the degree of difficulty in work increases due to temporary holding requirements

Engineering Contradiction:
Improveease of mountingVSAvoidmounting process complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent designs the signal terminals with enlarged lands that self-reinforce during the soldering process. The large land areas provide inherent mechanical strength and stability, allowing the terminals to support themselves without requiring external enclosing members or temporary holding fixtures. The mounting process becomes simpler as the terminals are self-sufficient during assembly.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10205857B2Image pickup device with land layout that enables reliable soldering, and mounting board therefor
Publication Date: 2019.02.12 CANON KK
  • US10205857B2 patent drawing
  • US10205857B2 patent drawing
  • US10205857B2 patent drawing

AI summary

An image pickup device which ensures reliability of soldering without reinforcement using any additional special members or fixing with an adhesive agent or the like. The image pickup device outputs an image signal corresponding to an optical image. Signal terminals are placed on one surface of the image pick device and soldered to a mounting board on which the image pickup device is to be mounted. Reinforcing terminals provided on the one surface, on which the signal terminal is placed, reinforce the image pickup device. A holding fixing unit holds the image pickup device on the mounting board. When the image pickup device is mounted on the mounting board, the reinforcing terminals are located between the signal terminals and the holding fixing unit.