Solid State Image Pickup Device Test Terminal Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor IC manufacturing processes require additional steps for testing, increasing costs and complexity, especially when dealing with soft materials like organic materials, where the performance of test pads can degrade the existing film performance.
Innovation Solution
A solid-state image pickup device with photoelectric conversion units arranged in a two-dimensional array on a semiconductor substrate, featuring pixel electrode films, opposing electrode films, and a light receiving layer, where test terminals are formed simultaneously with the pixel electrode films and signal read-out circuits, allowing for testing without a separate manufacturing process for the test terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate test pad manufacturing process is added, then testing capability is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent merges the test terminal manufacturing with the pixel electrode film manufacturing by forming both structures simultaneously through the same deposition and patterning processes. This integration eliminates the need for separate test pad fabrication steps, reducing manufacturing process complexity while maintaining testing capability.
Solution Approach 2:
The manufacturing process is designed to serve multiple functions: it simultaneously creates both the functional pixel electrode films and the test terminals. This multi-functionality allows the same process equipment and materials to produce both imaging components and testing components, reducing overall manufacturing complexity.
2Reliability
If additional manufacturing processes are added for test pads, then testing is enabled, but manufacturing cost increases
Solution Approach 1:
The patent combines the formation of test terminals with the pixel electrode film fabrication into a single integrated process. By using the same deposition and patterning steps for both structures, the patent eliminates redundant manufacturing operations and reduces overall production costs while enabling testing capability.
3Reliability
If test pad manufacturing is added for organic material devices, then testing is possible, but performance of organic material film degrades
Solution Approach 1:
The patent integrates test terminal fabrication with pixel electrode film formation using identical deposition and patterning processes. This approach ensures that the organic material film is exposed to the same controlled manufacturing conditions for both functional and test structures, preventing performance degradation that would result from separate, additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables testing during manufacturing without additional processes, reducing costs and maintaining the performance of organic material films, thereby improving manufacturing throughput and efficiency.
Implementation Method 1
Each of the plurality of photoelectric conversion units include a pixel electrode film, an opposing electrode film opposing the pixel electrode film and a light receiving layer sandwiched between the pixel electrode film and the opposing electrode film
Data Source
AI summary
A solid-state image pickup device includes a plurality of photoelectric conversion units, a plurality of signal read-out circuits, and a test terminal for testing the photoelectric conversion units. Each of the photoelectric conversion units includes a pixel electrode film, an opposing electrode film opposing the pixel electrode film and a light receiving layer disposed between the pixel electrode film and the opposing electrode film. The photoelectric conversion units are arranged in a two-dimensional array above a semiconductor substrate. Each of the signal read-out circuits are configured to read out a signal corresponding to an amount of electrical charges generated in the light receiving layer and transferred to the pixel electrode film. The test terminal is disposed outside of an area where the photoelectric conversion units are disposed, disposed on the same plane as the pixel electrode film, and made of the same material as the pixel electrode film.