Image Pickup Package Thermal Conductor Resin Frame

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The existing image pickup element package structures face challenges in efficiently dissipating heat due to the resin frame being between the substrate and the metal plate, inhibiting heat transfer and making it difficult to discharge heat effectively.

Innovation Solution

An image pickup element package is designed with a translucent substrate, a circuit board, and a support that includes a resin frame portion and a conductor portion, providing thermal connection between the circuit board and the fixation portion, allowing for efficient heat dissipation from the circuit board to the fixation portion via the conductor portion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a resin frame is provided between the substrate and the metal plate, then the package structure is complete and mechanically stable, but heat transfer from the substrate to the metal plate is inhibited

Engineering Contradiction:

Improvepackage structure stabilityVSAvoidheat transfer efficiency

Core Design Contradiction:

Stability of the object's compositionVSTemperature

Solution Approach 1:

The support structure is divided into two functional parts: a resin frame portion for mechanical stability and fixation, and a conductor portion for thermal conduction. This segmentation allows each part to optimize its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resin frame portion and conductor portion are integrated into a single support structure that combines mechanical support functions with thermal management functions, enabling simultaneous achievement of structural stability and efficient heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If the resin frame is placed between the substrate and metal plate, then the image pickup element is protected and positioned, but heat dissipation from the package becomes difficult

Engineering Contradiction:

Improveimage pickup element protectionVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The support is segmented into a resin frame portion that provides protection and positioning for the image pickup element, and a conductor portion that provides a thermal conduction path to the fixation portion for heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductor portion acts as an intermediary between the substrate (where heat is generated) and the fixation portion (where heat is dissipated), providing a dedicated thermal pathway that bypasses the thermal insulation effect of the resin frame.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If a metal plate is used for heat dissipation, then thermal conductivity is improved, but the resin frame blocks the thermal path

Engineering Contradiction:

Improvethermal conductivityVSAvoidthermal path configuration

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The support structure merges the resin frame portion and conductor portion into a unified component that simultaneously provides mechanical support and thermal conduction pathways, simplifying the overall device structure while maintaining effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient heat discharge inside the package, improving the heat dissipation characteristics and preventing malfunctions during long-time continuous shooting of high-definition images.

Implementation Method 1

The conductor portion is integrally provided in the resin frame portion and provides thermal connection between the circuit board and the fixation portion

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10580811B2Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus

Publication Date: 2020.03.03 SONY GROUP CORP

AI summary

An image pickup element package according to an embodiment of the present technology includes a solid-state image pickup element, a circuit board, a translucent substrate, and a support. The solid-state image pickup element includes a light-receiving surface, and a back surface on a side opposite to the light-receiving surface. The circuit board supports the back surface of the solid-state image pickup element. The translucent substrate is opposed to the light-receiving surface. The support includes a resin frame portion and a conductor portion and is disposed between the circuit board and the translucent substrate. The resin frame portion includes a hollow portion that houses the solid-state image pickup element, and a fixation portion that is fixed to a casing portion of an image-pickup device. The conductor portion is integrally provided in the resin frame portion and provides thermal connection between the circuit board and the fixation portion.